المؤلفون: Istvan, Hajdu, Amir, Hamadeh, Tamas, Lajter Peter, Attila, Geczy

المصدر: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2024 IMAPS Nordic Conference on. :1-5 Jun, 2024

Relation: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

المؤلفون: Grennerat, Vincent, Nashef, Georges Zakka El, Sabra, Ahmad, Xavier, Pascal, Lacrevaz, Thierry, Corrao, Nicolas, Liang, Haokai, Attila, Geczy, Chevalier, Nicolas

المصدر: 2024 18th European Conference on Antennas and Propagation (EuCAP) Antennas and Propagation (EuCAP), 2024 18th European Conference on. :1-5 Mar, 2024

Relation: 2024 18th European Conference on Antennas and Propagation (EuCAP)

المؤلفون: De Jorge Melgar, Ricardo Federico

المساهمون: Rodríguez Ballester, Francisco, Attila, Géczy, Universitat Politècnica de València. Departamento de Informática de Sistemas y Computadores - Departament d'Informàtica de Sistemes i Computadors, Universitat Politècnica de València. Escuela Técnica Superior de Ingeniería del Diseño - Escola Tècnica Superior d'Enginyeria del Disseny, Rodriguez Ballester, Francisco

الإتاحة: https://hispana.mcu.es/lod/oai:riunet.upv.es:10251_--_145605#ent0

المؤلفون: Attila Geczy, Csaba Farkas, Rebeka Kovacs, Denis Fros, Petr Vesely, Attila Bonyar

المصدر: IEEE Open Journal of Nanotechnology, Vol 3, Pp 182-190 (2022)

مصطلحات موضوعية: Printed circuit substrate, biodegradable materials, nanocomposites, nanomaterials, Chemical technology, TP1-1185, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9944849/; https://doaj.org/toc/2644-1292

URL الوصول: https://doaj.org/article/90b40d9f911d4e7d9c559160022d4d17

المؤلفون: Attila Geczy, Andras Csiszar, Pascal Xavier, Nicolas Corrao, Dominique Rauly, Robert Kovacs, Anna Eva Feher, Egon Rozs, Laszlo Gal

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::59d18b832a3e7542b901682a28015c2c
https://doi.org/10.1109/eptc56328.2022.10013255

المؤلفون: Daniel Straubinger, Attila Toth, Viktor Kerek, Zsolt Czeczei, Andras Szabo, Attila Geczy

المصدر: Soldering & Surface Mount Technology. 34:203-211

مصطلحات موضوعية: General Materials Science, Electrical and Electronic Engineering, Condensed Matter Physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1ec2391449fa5685033d7938fff260a9
https://doi.org/10.1108/ssmt-06-2021-0039

المؤلفون: Balint Medgyes, Balazs Illes, Oliver Krammer, Attila Geczy, Slavka Tzanova, Maria Afsar

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e8bc2fe0cc36510cede484cfb1a47e63
https://doi.org/10.1109/estc55720.2022.9939556

المؤلفون: Attila Geczy, Andras Csiszar, Egon Rozs, Istvan Hajdu, Balint Medgyes, Oliver Krammer, Daniel Straubinger, Laszlo Gal

المصدر: 2022 45th International Spring Seminar on Electronics Technology (ISSE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::12c83c8bf9afd939de2b23fdaefdc8d1
https://doi.org/10.1109/isse54558.2022.9812827

المؤلفون: Attila Geczy, Mohamed Amine Alaya, Egon Rozs, Daniel Straubinger, Balazs Illes

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec22f97903bd0d91e5afcc31eca70caa
https://doi.org/10.1109/eptc53413.2021.9663870

المؤلفون: Attila Geczy, Lajos Kuglics, Istvan Megyeri, Robert Gelbmann, Gabor Harsanyi

المصدر: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b00893867d97cb27169e845e21565df5
https://doi.org/10.1109/siitme53254.2021.9663576