المؤلفون: Olga Sikora, Małgorzata Sternik, Benedykt R. Jany, Franciszek Krok, Przemysław Piekarz, Andrzej M. Oleś

المصدر: Beilstein Journal of Nanotechnology, Vol 14, Iss 1, Pp 1093-1105 (2023)

مصطلحات موضوعية: au/ge heterostructures, density functional theory, electronic structure, hexagonal gold, interface energy, Technology, Chemical technology, TP1-1185, Science, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2190-4286

URL الوصول: https://doaj.org/article/d7e9bb1bccc94564bb39d9a4b98adf62

المؤلفون: Gyöngyi Vastag, Peter Majerič, Vojkan Lazić, Rebeka Rudolf

المصدر: Metals, Vol 14, Iss 6, p 668 (2024)

مصطلحات موضوعية: Au-Ge alloy, electrochemical properties, characterisation, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/14/6/668; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/7127f7542eaf4dbc988497a0515aaddb

المؤلفون: Larsson, Andreas, Thoresen, Christian Bjorge, Aamli, Thomas

المصدر: 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2019 Pan Pacific. :1-12 Feb, 2019

Relation: 2019 Pan Pacific Microelectronics Symposium (Pan Pacific)

المؤلفون: Larsson, A., Thoresen, C.B.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(12):2465-2475 Dec, 2019

المؤلفون: Yuchen Bai, Qingsong Tong, Maohua Rong, Cong Tan, Xingyu Liu, Man Li, Jiang Wang

المصدر: Materials, Vol 17, Iss 9, p 2137 (2024)

مصطلحات موضوعية: Au-Ge based alloys, phase equilibria, thermodynamics, CALPHAD, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/9/2137; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/196edd84013a4c96b2ffd4dc5563dc0a

المؤلفون: Liu, Li, Cui, Jinzi, Wang, Jing, Zhou, Zhaoxia, Johnson, R. Wayne, Liu, Changqing

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :417-422 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Roshanghias, Ali, Bruckner, Gudrun, Binder, Alfred

المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :181-184 Nov, 2016

Relation: 2016 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Larsson, Andreas, Tollefsen, Torleif A., Aasmundtveit, Knut E., Lovvik, Ole Martin

المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-3 Sep, 2017

Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

المؤلفون: Meng Wang, Huashan Liu, Jian Peng

المصدر: Journal of Materials Research and Technology, Vol 19, Iss , Pp 605-616 (2022)

مصطلحات موضوعية: Au–Ge, Solder joint, Solid solution, Shear strength, Interfacial reaction products, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785422007293; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/c2ee4974282a4131ab43db08bb2906ae

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