يعرض 1 - 10 نتائج من 424 نتيجة بحث عن '"Au-Sn"', وقت الاستعلام: 1.47s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs

    المؤلفون: Yin, L., Zhou, H., Ji, X., Li, J., Wang, K., Li, C., Zhang, J.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):1999-2004 Mar, 2024

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  2. 2
    مؤتمر
    Study on the Manufacturing Process of Multilayer Silicon-based Filters Based on Au-Sn Soldering

    المؤلفون: Gong, Yaolong, Yang, Shicheng, Li, Sheng, Wang, Feng, Xia, Weijuan, Wang, Ping

    المصدر: 2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) Electromagnetics: Applications and Student Innovation Competition (iWEM), 2023 IEEE International Workshop on. :233-236 Jul, 2023

    Relation: 2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)

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  3. 3
    دورية أكاديمية
    A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer

    المؤلفون: Hu, Yuhua, Zhang, Yan, Bao, ZuguoAff2, IDs11664023108811_cor3, Wu, Jing, Li, Jie, Wu, Jie, Huang, Min

    المصدر: Journal of Electronic Materials. 53(3):1414-1424

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  4. 4
    مؤتمر
    Low Temperature Au/Sn Solid-Liquid Diffusion Chip-to-Chip Bonding for MEMS Encapsulation

    المؤلفون: Wenchao, Wang, Liu, Ziyu, Zhiyuan, Zhu, Lin, Chen, Qingqing, Sun

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Effects of electroplating parameters on composition and morphology of Au-Sn alloy films

    المؤلفون: Huang, Feifei, Huang, Mingliang

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Non-cyanide Electroplating of Gold-Tin Eutectic Alloy for Flip-Chip Packaging of LED

    المؤلفون: Huang, Mingliang, Fang, Chao, Huang, Feifei, Yan, Yan

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Low Temperature and Short Time Au/Sn Solid-liquid Diffusion Bonding for 3D Integration

    المؤلفون: Liu, Ziyu, Wenchao, Wang, Zhiyuan, Zhu, Lin, Chen, Qingqing, Sun

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications

    المؤلفون: Mariappan, Murugesan, Koyanagi, Mitsumasa, Fukushima, Takafumi

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1448-1452 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  9. 9
    دورية أكاديمية
    Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation

    المؤلفون: Temel, O., Kalay, Y.E., Akin, T.

    المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 30(1):64-71 Feb, 2021

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  10. 10
    مؤتمر
    Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy

    المؤلفون: Lu, Chunyan, Huang, Feifei, Huang, Mingliang

    المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

    Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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