المؤلفون: Schirmer, Patrick, Ringelstetter, Severin

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-3 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Park, J., Lee, S., Lee, H.J., Paik, K.

المصدر: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control IEEE Trans. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on. 67(10):2148-2154 Oct, 2020

المؤلفون: Jung, S., Oh, S.J., Lee, T., Kim, T., Paik, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(1):176-183 Jan, 2020

المؤلفون: Jung, Seung-Yoon, Paik, Kyung-Wook

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :2301-2306 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Deepthi Sekhar, Ewa Lisicka-Skrzek, Pierre Berini

المصدر: Micro and Nano Engineering, Vol 21, Iss , Pp 100227- (2023)

مصطلحات موضوعية: BCB, B-stage bisbenzocyclobutene, Cytop, Microfluidics, Wafer bonding, Electronics, TK7800-8360, Technology (General), T1-995

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2590007223000576; https://doaj.org/toc/2590-0072

URL الوصول: https://doaj.org/article/8bac0a41f5d347c6a40880d4ec72b176

المؤلفون: Jung, Seung-Yoon, Paik, Kyung-Wook

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2145-2150 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim, K., Yu, W., Cho, S.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(4):1007-1016 Apr, 2014

المؤلفون: Whitmore, Mark, Schake, Jeff

المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-8 Nov, 2008

Relation: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

المؤلفون: Stefania Brozzetti, Chiara D’Alterio, Simone Bini, Jessica Antimi, Bianca Rocco, Alessia Fassari, Pierleone Lucatelli, Piergiorgio Nardis, Michele Di Martino, Giuseppe Maria De Sanctis, Mario Corona, Oreste Bagni, Enrico Cortesi, Mario Bezzi, Carlo Catalano

المصدر: Cancers, Vol 14, Iss 18, p 4422 (2022)

مصطلحات موضوعية: hepatocellular carcinoma, liver resection, TACE, BCLC-B stage, multidisciplinary tumor board, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-6694/14/18/4422; https://doaj.org/toc/2072-6694

URL الوصول: https://doaj.org/article/dbfe3399ca57457ca7dbcfaae9651a04

المؤلفون: Chung, C.L., Hsu, H.C., Fu, S. L.

المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :40-43 Oct, 2008

Relation: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)