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1مؤتمر
المؤلفون: Schirmer, Patrick, Ringelstetter, Severin
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-3 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2دورية أكاديمية
المصدر: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control IEEE Trans. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on. 67(10):2148-2154 Oct, 2020
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3دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(1):176-183 Jan, 2020
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4مؤتمر
المؤلفون: Jung, Seung-Yoon, Paik, Kyung-Wook
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :2301-2306 May, 2018
Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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5دورية أكاديمية
المؤلفون: Deepthi Sekhar, Ewa Lisicka-Skrzek, Pierre Berini
المصدر: Micro and Nano Engineering, Vol 21, Iss , Pp 100227- (2023)
مصطلحات موضوعية: BCB, B-stage bisbenzocyclobutene, Cytop, Microfluidics, Wafer bonding, Electronics, TK7800-8360, Technology (General), T1-995
وصف الملف: electronic resource
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6مؤتمر
المؤلفون: Jung, Seung-Yoon, Paik, Kyung-Wook
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2145-2150 May, 2017
Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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7دورية أكاديمية
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(4):1007-1016 Apr, 2014
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8مؤتمر
المؤلفون: Whitmore, Mark, Schake, Jeff
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-8 Nov, 2008
Relation: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
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9دورية أكاديمية
المؤلفون: Stefania Brozzetti, Chiara D’Alterio, Simone Bini, Jessica Antimi, Bianca Rocco, Alessia Fassari, Pierleone Lucatelli, Piergiorgio Nardis, Michele Di Martino, Giuseppe Maria De Sanctis, Mario Corona, Oreste Bagni, Enrico Cortesi, Mario Bezzi, Carlo Catalano
المصدر: Cancers, Vol 14, Iss 18, p 4422 (2022)
مصطلحات موضوعية: hepatocellular carcinoma, liver resection, TACE, BCLC-B stage, multidisciplinary tumor board, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282
وصف الملف: electronic resource
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10مؤتمر
المؤلفون: Chung, C.L., Hsu, H.C., Fu, S. L.
المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :40-43 Oct, 2008
Relation: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)