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1
المؤلفون: N. Jöhrmann, C. Stöckel, B. Wunderle
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::39793afcf81008081497e3f584a8c03d
https://doi.org/10.1109/eurosime56861.2023.10100848 -
2
المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, B. Wunderle, M. Abo Ras
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9cf1612f430eae8555a93daba8f93e5
https://doi.org/10.1109/eurosime56861.2023.10100762 -
3
المؤلفون: R. Kniely, J. Heilmann, F. Huber, B. Wunderle
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ae6e6ff93d088250cc050104222ee378
https://doi.org/10.1109/eurosime56861.2023.10100778 -
4دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
5
المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, R. Schacht, M. Abo Ras, B. Wunderle
المصدر: Microelectronics Reliability. 142:114910
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials
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6
المؤلفون: M. Tavakolibasti, P. Meszmer, M. Kettelgerdes, G. Bottger, G. Elger, H. Erdogan, A. Seshaditya, B. Wunderle
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c79a7f0b11771d77337ac1412cc132ed
https://doi.org/10.1109/eurosime54907.2022.9758897 -
7
المؤلفون: R. Kniely, F. Huber, J. Heilmann, M. Schulz, B. Wunderle
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::29b7df3e11a608fd2d02015fc49b8104
https://doi.org/10.1109/eurosime54907.2022.9758857 -
8
المؤلفون: N. Johrmann, C. Stockel, B. Wunderle
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8deed67c71e8df5f433d4cdedb440b8b
https://doi.org/10.1109/eurosime54907.2022.9758838 -
9
المؤلفون: D. May, J. Heilmann, M. Schulz, E. Boschman, M. Abo Ras, B. Wunderle
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d66e2ade2157315359e1f19e1f296ef0
https://doi.org/10.1109/eurosime54907.2022.9758871 -
10
المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, A. Stelzer, B. Rabay, D. Busse, B. Wunderle, M. Abo Ras
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::502d8284a4beb10267fed64d594f81e8
https://doi.org/10.1109/eurosime54907.2022.9758907