المؤلفون: Brun, C., Diagne, C., Elchinger, P., Torrengo, S., Thuaire, A., Gasparutto, D., Tiron, R., Baillin, X.

المصدر: IEEE Nanotechnology Magazine IEEE Nanotechnology Mag. Nanotechnology Magazine, IEEE. 11(1):12-19 Mar, 2017

المؤلفون: Thuaire, A., Reynaud, P., Brun, C., Sordes, D., Carmignani, C., Rolland, E., Baillin, X., Cheramy, S., Poupon, G.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 6(12):1804-1814 Dec, 2016

المؤلفون: Nicolas, S., Greco, F., Caplet, S., Coutier, C., Dressler, C., Audoin, M., Baillin, X., Dehag, G., Souchon, F., Fanget, S.

المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1714-1721 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

المؤلفون: Savornin, B., Baillin, X., Blanquet, E., Nuta, I., Patrice, D. Saint, Nicolas, P., Charvet, P. L., Pornin, J. L

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1514-1518 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Nicolas, S., Caplet, S., Greco, F., Audoin, M., Baillin, X., Fanget, S.

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :370-376 May, 2012

Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Garnier, A., Lagoutte, E., Baillin, X., Gillot, C., Sillon, N.

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1610-1615 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

المؤلفون: Ferrandon, C., Greco, F., Lagoutte, E., Descours, P., Enyedy, G., Pellat, M., Gillot, C., Rey, P., Mercier, D., Cueff, M., Baillin, X., Perruchot, F., Sillon, N., Liu, L.J., Pacheco, S., Miller, M.

المصدر: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Henry, D., Jacquet, F., Neyret, M., Baillin, X., Enot, T., Lapras, V., Brunet-Manquat, C., Charbonnier, J., Aventurier, B., Sillon, N.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :556-562 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Henry, D., Baillin, X., Lapras, V., Sillon, N., Dunne, B., Hernandez, C., Vigier-Blanc, E.

المصدر: 2007 9th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. :215-221 Dec, 2007

Relation: 2007 9th Electronics Packaging Technology Conference

المؤلفون: Henry, D., Baillin, X., Lapras, V., Vaudaine, MH., Quemper, JM., Sillon, N., Dunne, B., Hernandez, C., Vigier-Blanc, E.

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :830-835 Jun, 2007

Relation: 2007 57th Electronic Components and Technology Conference