يعرض 1 - 10 نتائج من 2,518 نتيجة بحث عن '"BGA"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    مؤتمر
    Large package body size scaling with two novel technologies: Multi Ball BGA and Liquid Metal Interconnect

    المؤلفون: Lu, Xiao, Wu, Jiaqi, Lee, Sangeon, Meyyappan, Karumbu

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1293-1297 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Development of Thick-Core Substrate Material for Cutting-Edge IC Packaging

    المؤلفون: Muguruma, Tomo, Shin, Tom, Honma, Masafumi, Saito, Hirosuke, Takahashi, Genki, Yasumoto, Jun, Washio, Teppei, Ishikawa, Yuichi, Tashiro, Yutaka, Okushima, Yoshiki, Biruni, Ahammad Al, Takahashi, Ryuji

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :881-886 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    BGA electromigration behavior and why it has become the bottleneck

    المؤلفون: Labie, Riet, Nawghane, Chinmay, Tsiakos, Dimitrios, Mertens, Jan, Tremble, Eric, Graf, Richard, Sauter, Wolfgang

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :678-684 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Bayesian Optimization of Large Glass Package Architecture for System-Level Reliability in High-Performance Computing Applications

    المؤلفون: Surillo, Emanuel Torres, Sosa, Ramon A., Molina, Christian, Park, Hyunggyu, Nimbalkar, Pratik, Srirangan, Sriram, Dahal, Lila D., Lee, Yongwon, Smet, Vanessa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :246-253 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Pad Cratering and Pin Pull Strength for Large BGA and Connectors — How Are They Correlated?

    المؤلفون: Xie, Dongji, Hai, Joe, Zou, Vivienne, Wu, Zhongming, Jian, Minghong

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1468-1472 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints

    المؤلفون: Coyle, Richard, Anselm, Martin, Feng, Chloe, Popowich, Richard

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1452-1459 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)

    المؤلفون: Depiver, Joshua, Mallik, Sabuj, Amalu, Emeka H.

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-6 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  8. 8
    مؤتمر
    Impact of Port Type in S-Parameter Extraction of Package and PCB High-Speed Interconnections

    المؤلفون: Occhiali, Marco, Sanna, Aurora, Cucchi, Simona

    المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024

    Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)

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  9. 9
    مؤتمر
    Advanced Package Decoupling Study for Power Integrity Optimization of High-End Digital Devices

    المؤلفون: Cucchi, Simona, Sanna, Aurora

    المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024

    Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)

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  10. 10
    مؤتمر
    A Comprehensive Thermo-Mechanical Characterization of Organic Substrates

    المؤلفون: Rovitto, Marco, Zalaffi, Samuele, Spini, Daniela

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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