المؤلفون: Pavan, J., Dalla Man, C., Herzig, D., Bally, L., Del Favero, S.

المصدر: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2021 43rd Annual International Conference of the IEEE. :677-680 Nov, 2021

Relation: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

المؤلفون: Pavan, J., Dalla Man, C., Herzig, D., Bally, L., Del Favero, S.

المصدر: In Computer Methods and Programs in Biomedicine October 2022 225

المؤلفون: Fournel, F., Sanchez, L., Montmayeul, B., Castan, C., Laugier, M., Bally, L., Larrey, V., Mauguen, G., Cheramy, S., Jouve, A., Rolland, E., Morales, C., Szelag, B., Hassan, K., Adelimini, L., Rieutord, F.

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :16-16 May, 2019

Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Jouve, A., Vial, K., Rolland, E., Coudrain, P., Aumont, C., Laviron, C., Fournel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Donche, C., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Cheramy, S., Sillon, N.

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :101-106 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Vial, K., Jouve, A., Rolland, E., Coudrain, P., Aumont, C., Foumel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Laviron, C., Cheramy, S., Sillon, N.

المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :445-450 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

المؤلفون: Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., Di Cioccio, L., Carron, V., Signamarcheix, T., Taibi, R., Mermoz, S., Lecarpentier, G.

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1960-1964 May, 2012

Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Dimou, M.^{Aff1, Aff2}, Laimer, M., Stettler, C., Bally, L.^Aff2

المصدر: Der Internist. 61(1):102-109

المؤلفون: Tripyla, A., Ferreira, A., Schoenenberger, K., Naef, N., Inderbitzin, L., Cossu, L., Cappon, G., Facchinetti, A., Herzig, D., Bally, L.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______3657::300b78831c8a1c99bc6ea6d296a67f88
https://hdl.handle.net/11577/3471907

المؤلفون: Cossu, L., Cappon, G., Herzig, D., Bally, L., Facchinetti, and A.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______3657::5093b47b6a4796c7f14de87db86a099d
https://hdl.handle.net/11577/3471909

المؤلفون: Prendin, F., Herzig, D., Tripyla, A., Cappon, G., Bally, L., Facchinetti, and A.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______3657::77989d5b1061e7f49b79fecfb21a65b2
https://hdl.handle.net/11577/3471905