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1مؤتمر
المؤلفون: Pavan, J., Dalla Man, C., Herzig, D., Bally, L., Del Favero, S.
المصدر: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2021 43rd Annual International Conference of the IEEE. :677-680 Nov, 2021
Relation: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
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2دورية أكاديمية
المؤلفون: Pavan, J., Dalla Man, C., Herzig, D., Bally, L., Del Favero, S.
المصدر: In Computer Methods and Programs in Biomedicine October 2022 225
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3مؤتمر
المؤلفون: Fournel, F., Sanchez, L., Montmayeul, B., Castan, C., Laugier, M., Bally, L., Larrey, V., Mauguen, G., Cheramy, S., Jouve, A., Rolland, E., Morales, C., Szelag, B., Hassan, K., Adelimini, L., Rieutord, F.
المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :16-16 May, 2019
Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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4مؤتمر
المؤلفون: Jouve, A., Vial, K., Rolland, E., Coudrain, P., Aumont, C., Laviron, C., Fournel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Donche, C., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Cheramy, S., Sillon, N.
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :101-106 May, 2013
Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Vial, K., Jouve, A., Rolland, E., Coudrain, P., Aumont, C., Foumel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Laviron, C., Cheramy, S., Sillon, N.
المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :445-450 Dec, 2012
Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)
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6مؤتمر
المؤلفون: Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., Di Cioccio, L., Carron, V., Signamarcheix, T., Taibi, R., Mermoz, S., Lecarpentier, G.
المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1960-1964 May, 2012
Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)
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7دورية أكاديمية
المؤلفون: Dimou, M.Aff1, Aff2, Laimer, M., Stettler, C., Bally, L.Aff2
المصدر: Der Internist. 61(1):102-109
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