المؤلفون: Liu, W., Bai, X., Yang, H., Bao, R., Liu, J.

المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(6):5417-5424 Jun, 2024

المؤلفون: Li, Z., Bao, R., Zhang, W., Wang, F., Wang, J., Fang, R., Ren, H., Lin, N., Yue, J., Dou, C., Wang, Z., Shang, D.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(5):2614-2618 May, 2024

المؤلفون: Zhu, F., Wu, B., Destrade, M., Wang, H., Bao, R., Chen, W.

المصدر: International Journal of Solids and Structures 290 (2024) 112671

مصطلحات موضوعية: Condensed Matter - Soft Condensed Matter, Nonlinear Sciences - Pattern Formation and Solitons

URL الوصول: http://arxiv.org/abs/2406.13483

المؤلفون: Bao, R., Palaniappan, K., Zhao, Y., Seetharaman, G.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(7):11610-11624 Apr, 2024

المؤلفون: Liu, Y., Zhu, Z., Bao, R., Lin, J., Yin, J., Li, Q., Mak, P., Yang, S.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 71(2):515-525 Feb, 2024

المؤلفون: Bao, R., Qin, L., Frougier, J., Suk, S., Rabie, M., Bajpai, U., Chou, A., Nechay, B., Mohamed, M., Pujari, R., Weir, T. J, Harmon, K., Varma, A., Armstrong-Moore, W., Cestero, A., Emans, S., Hundekar, P., Joshi, R., Li, J., Liu, X., Lucarini, S., Radens, C., Siddiqui, S., Trombley, H., Bryant, A., Hasanuzzaman, M., Majumdar, A., Sung, M., Zhang, J., Leobandung, E.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Mu, J., Lyu, C., Hui, J., Bao, R., Chi, X., Liu, C.

المصدر: 2024 IEEE International Conference on Plasma Science (ICOPS) Plasma Science (ICOPS), 2024 IEEE International Conference on. :1-1 Jun, 2024

Relation: 2024 IEEE International Conference on Plasma Science (ICOPS)

المؤلفون: Zhu, Z., Guo, C., Bao, R., Chen, M., Saad, W., Yang, Y.

المصدر: IEEE Transactions on Wireless Communications IEEE Trans. Wireless Commun. Wireless Communications, IEEE Transactions on. 22(10):6962-6977 Oct, 2023

المؤلفون: Zeng, Y., Yang, S., Liu, Y., Bao, R., Zhu, Z., Lin, J., Zhou, X., Chen, Y., Yin, J., Mak, P., Li, Q.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(18):21747-21756 Sep, 2023

المؤلفون: Wei, Y., Yang, S., Liu, Y., Bao, R., Zhu, Z., Lin, J., Zhang, Z., Chen, Y., Yin, J., Mak, P., Li, Q.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 31(8):1248-1252 Aug, 2023