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1مؤتمر
المؤلفون: Hsiung, Chien-Kang, Wang, Terry, Wozny, Sarah, Bernt, Marvin L, Chen, Kuan-Nang
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1896-1899 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Boon, Soh Siew, Chui, K. J., David Ho, S. W., Sek, S. A., Yu, Mingbin, Lianto, Prayudi, Gu, Yu, See, Guan Huei, Bernt, Marvin L.
المصدر: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :662-665 Nov, 2016
Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
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3مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L.
المصدر: Proceedings of SPIE; Nov1995, Issue 1, p108-112, 5p
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4مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L., Schiff, Tod F.
المصدر: Proceedings of SPIE; Nov1995, Issue 1, p21-25, 5p
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5مؤتمر
المؤلفون: Bernt, Marvin L., Stover, John C.
المصدر: Proceedings of SPIE; Nov1995, Issue 1, p36-44, 9p
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6مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L., Church, Eugene L., Takacs, Peter Z.
المصدر: Proceedings of SPIE; 11/ 1/1994, Issue 1, p182-191, 10p
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7مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L., Church, Eugene L.
المصدر: Proceedings of SPIE; 11/ 1/1994, Issue 1, p40-49, 10p
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8مؤتمر
المؤلفون: Bender, James A., Henning, Timothy D., Bernt, Marvin L.
المصدر: Proceedings of SPIE; Nov1993, Issue 1, p121-126, 6p
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9مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L.
المصدر: Proceedings of SPIE; Nov1993, Issue 1, p115-120, 6p
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10مؤتمر
المؤلفون: Stover, John C., Bernt, Marvin L., Egert, Charles M.
المصدر: Proceedings of SPIE; Nov1993, Issue 1, p256-266, 11p