المؤلفون: Chang, John, Song, Xing, Chang, Timothy, Best, Keith

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2070-2074 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kasprowicz, Bryan, Mogharrabi, Siamak, Carrier, Martin, Zanzal, Andrew, Reynolds, Patrick, Shay, Corey, Best, Keith

المصدر: 2020 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2020 International. :1-6 Oct, 2020

Relation: 2020 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Hayes, Colin, Wang, Kevin, Bell, Rosemary, Calabrese, Colin, Gallagher, Michael, Thompson, Kirk, Barr, Robert K., Best, Keith, Shay, Corey, Ayala, Christian

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :623-628 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chang, John, Best, Keith, Lu, Jian, Ali, Burhan, Marshall, Mike

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :918-923 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Best, Keith, Chang, John, Marshall, Mike, Lu, Jian

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-5 Oct, 2019

Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Best, Keith, Marshall, Mike

المصدر: 2018 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2018 International. :1-6 Oct, 2018

Relation: 2018 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Best, Keith, Singh, Gurvinder, McCleary, Roger

المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1090-1094 Aug, 2016

Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Maury, Pascale, Quemper, Jean-Marie, Pocas, Stephane, Vliet, Dick Van, Noordam, Nico, Berge, Peter ten, Best, Keith

المصدر: In Microelectronic Engineering 2010 87(5):904-906

المساهمون: Johnston, Turlough, Stålbrand, Kerstin M, Best, Keith, Hult, Bengt O

المؤلفون: Best, Keith

المصدر: Federalist Debate (16829670); Nov2022, Vol. 35 Issue 3, p51-54, 4p

مصطلحات موضوعية: INTERNATIONAL organization, CIVIL war, PUBLIC opinion, WORLD War I, WORLD War II, PLEBISCITE, POLITICAL science