المؤلفون: Rao, N.R.H., Beyer, V., Thielemans, W., Muylaert, K.

المصدر: In Algal Research July 2024 81

المؤلفون: Ocker, J., Slesazeck, S., Hoffmann, R., Beyer, V., Skouris, A., Srowik, R., Buschbeck, S., Gunther, S., Mikolajick, T.

المصدر: 2015 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2015 IEEE International. :13-16 Oct, 2015

Relation: 2015 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ocker, J., Slesazeck, S., Mikolajick, T., Buschbeck, S., Gunther, S., Yurchuk, E., Hoffmann, R., Beyer, V.

المصدر: 2015 45th European Solid State Device Research Conference (ESSDERC) Solid State Device Research Conference (ESSDERC), 2015 45th European. :118-121 Sep, 2015

Relation: ESSDERC 2015 - 45th European Solid-State Device Research Conference

المؤلفون: Nguyen, C. D., Kuligk, A., Vexler, M. I., Klawitter, M., Beyer, V., Melde, T., Czernohorsky, M., Meinerzhagen, B.

المصدر: 2010 International Conference on Simulation of Semiconductor Processes and Devices Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on. :261-264 Sep, 2010

Relation: 2010 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2010)

المؤلفون: Loehr, D-A., Hoffmann, R., Naumann, A., Paul, J., Seidel, K., Czernohorsky, M., Beyer, V.

المصدر: 2010 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International. :89-91 Oct, 2010

Relation: 2010 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Seidel, K., Hoffmann, R., Naumann, A., Paul, J., Lohr, D.A., Czernohorsky, M., Beyer, V.

المصدر: 2010 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International. :95-97 Oct, 2010

Relation: 2010 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Beyer, V., Kuchenmeister, F., Bottcher, M., Meusel, E.

المصدر: Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Adhesive joining and coating technology in electronics manufacturing Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on. :112-115 1998

Relation: Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98

المؤلفون: Kuchenmeister, F., Bottcher, M., Beyer, V., Thierbach, S., Ekkehard, M., Agater, M., Kickelhain, J., Meier, D.

المصدر: 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Electronic components and technology Electronic Components & Technology Conference, 1998. 48th IEEE. :320-324 1998

Relation: 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

المؤلفون: Seidel, K., Muller, T., Brandt, T., Hoffmann, R., Lohr, D. A., Melde, T., Czernohorsky, M., Paul, J., Beyer, V.

المصدر: 2009 10th Annual Non-Volatile Memory Technology Symposium (NVMTS) Non-Volatile Memory Technology Symposium (NVMTS), 2009 10th Annual. :72-76 Oct, 2009

Relation: 2009 10th Annual Non-Volatile Memory Technology Symposium (NVMTS)

المؤلفون: Seidel, K., Hoffmann, R., Lohr, D. A., Melde, T., Czernohorsky, M., Paul, J., Beug, M. F., Beyer, V.

المصدر: 2009 10th Annual Non-Volatile Memory Technology Symposium (NVMTS) Non-Volatile Memory Technology Symposium (NVMTS), 2009 10th Annual. :67-71 Oct, 2009

Relation: 2009 10th Annual Non-Volatile Memory Technology Symposium (NVMTS)