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1دورية أكاديمية
المؤلفون: Beyer, G, Hoffmeister, A, Michl, P, Gress, TM, Huber, W, Algul, H, Neesse, A, Meining, A, Seufferlein, TW, Rosendahl, J, Kahl, S, Keller, J, Werner, J, Friess, H, Bufler, P, Lohr, MJ, Schneider, A, Jansen, PL, Esposito, I, Grenacher, L, Mossner, J, Lerch, MM, Mayerle, J
المصدر: Zeitschrift fur Gastroenterologie. 60(03):419-521
مصطلحات موضوعية: Medicin och hälsovetenskap
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2دورية أكاديمية
المؤلفون: Overbeek, KA, Poulsen, JL, Lanzillotta, M, Vinge-Holmquist, O, Macinga, P, Demirci, AF, Sindhunata, DP, Backhus, J, Algul, H, Buijs, J, Levy, P, Kiriukova, M, Goni, E, Hollenbach, M, Miksch, RC, Kunovsky, L, Vujasinovic, M, Nikolic, S, Dickerson, L, Hirth, M, Neurath, MF, Zumblick, M, Vila, J, Jalal, M, Beyer, G, Frost, F, Carrara, S, Kala, Z, Jabandziev, P, Sisman, G, Akyuz, F, Capurso, G, Falconi, M, Arlt, A, Vleggaar, FP, Barresi, L, Greenhalf, B, Czako, L, Hegyi, P, Hopper, A, Nayar, MK, Gress, TM, Vitali, F, Schneider, A, Halloran, CM, Trna, J, Okhlobystin, A, Dagna, L, Cahen, DL, Bordin, D, Rebours, V, Mayerle, J, Kahraman, A, Rasch, S, Culver, E, Kleger, A, Martinez-Moneo, E, Rokke, O, Hucl, T, Olesen, SS, Bruno, MJ, Della-Torre, E, Beuers, U, Lohr, JM, Rosendahl, J
المصدر: Clinical gastroenterology and hepatology : the official clinical practice journal of the American Gastroenterological Association. 22(5):994
مصطلحات موضوعية: Medicin och hälsovetenskap
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3دورية أكاديمية
المؤلفون: Veloso, A., Jourdain, A., Radisic, D., Chen, R., Arutchelvan, G., O'Sullivan, B., Arimura, H., Stucchi, M., De Keersgieter, A., Hosseini, M., Hopf, T., D'have, K., Wang, S., Dupuy, E., Mannaert, G., Vandersmissen, K., Iacovo, S., Marien, P., Choudhury, S., Schleicher, F., Sebaai, F., Oniki, Y., Zhou, X., Gupta, A., Schram, T., Briggs, B., Lorant, C., Rosseel, E., Hikavyy, A., Loo, R., Geypen, J., Batuk, D., Martinez, G.T., Soulie, J.P., Devriendt, K., Chan, B.T., Demuynck, S., Hiblot, G., Van der Plas, G., Ryckaert, J., Beyer, G., Litta, E.D., Beyne, E., Horiguchi, N.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(12):7173-7179 Dec, 2022
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4دورية أكاديمية
المؤلفون: Weiss, L.Aff1, Aff2, Aff10, Heinrich, K., Zhang, D.Aff1, Aff3, Dorman, K.Aff1, Aff3, Rühlmann, K., Hasselmann, K., Klauschen, F.Aff3, Aff4, Kumbrink, J.Aff3, Aff4, Jung, A.Aff3, Aff4, Rudelius, M., Mock, A., Ormanns, Steffen, Kunz, W. G., Roessler, D.Aff6, Aff10, Beyer, G.Aff6, Aff10, Corradini, S., Heinzerling, L.Aff7, Aff8, Haas, M., von Bergwelt-Baildon, M.Aff1, Aff3, Boeck, S.Aff1, Aff2, Aff3, Heinemann, V.Aff1, Aff2, Westphalen, C. B.Aff1, Aff2, Aff3, Aff10, IDs0043202304741y_cor22
المصدر: Journal of Cancer Research and Clinical Oncology. 149(11):8225-8234
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5مؤتمر
المؤلفون: Peng, L., Kim, S-W, Iacovo, S., de Vos, J., Schoenaers, B., Stesmans, A., Afanas'ev, V. V., Miller, A., Beyer, G., Beyne, E.
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :464-467 Dec, 2020
Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
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6مؤتمر
المؤلفون: Cherman, V., Van Huylenbroeck, S., Lofrano, M., Chang, X., Oprins, H., Gonzalez, M., Van der Plas, G., Beyer, G., Rebibis, K. J., Beyne, E.
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :548-553 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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7مؤتمر
المؤلفون: Furuhashi, T., Haneda, M., Sasaki, T., Kagawa, Y., Ooka, Y., Hirano, T., Saito, M., Ohno, K., Iwamoto, H., Liu, Y., Hiblot, G., Vanstreels, K., Gonzalez, M., Velenis, D., Beyer, G., Plas, G. Van der, Wolf, I. De, Beyne, E.
المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-4 Sep, 2019
Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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8مؤتمر
المؤلفون: Derakhshandeh, J., Beyne, E., Capuz, G., Inoue, F., Cherman, V., De Preter, I., Duval, F., Slabbekoorn, J., Gerets, C., Heyvaert, C., Beirnaert, F., Cochet, T., Bex, P., Hou, L., Lofrano, M., Jamieson, G., Heylen, N., Suhard, S., Honore, M., Webers, T., Bertheau, J., Phommahaxay, A., Van der Plas, G., Rebibis, K. J., Miller, A., Beyer, G.
المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-6 Sep, 2019
Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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9مؤتمر
المؤلفون: Podpod, Velenis, D., Phommahaxay, A., Bex, P., Fodor, F., Marinissen, EJ., Rebibis, K., Miller, A., Beyer, G., Beyne, E.
المصدر: 2018 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2018 International. :1-5 Oct, 2018
Relation: 2018 International Wafer Level Packaging Conference (IWLPC)
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10مؤتمر
المؤلفون: Veloso, A., Jourdain, A., Hiblot, G., Schleicher, F., D'have, K., Sebaai, F., Radisic, D., Loo, R., Hopf, T., De Keersgieter, A., Arimura, H., Eneman, G., Favia, P., Geypen, J., Arutchelvan, G., Chasin, A., Jang, D., Nyns, L., Rosseel, E., Hikavyy, A., Mannaert, G., Chan, B. T., Devriendt, K., Demuynck, S., Plas, G. Van der, Ryckaert, J., Beyer, G., Litta, E. Dentoni, Beyne, E., Horiguchi, N.
المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
Relation: 2021 Symposium on VLSI Technology