يعرض 1 - 10 نتائج من 61 نتيجة بحث عن '"Bharath, Krishna"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2021 International Conference on Computational Performance Evaluation (ComPE) Computational Performance Evaluation (ComPE), 2021 International Conference on. :810-814 Dec, 2021

    Relation: 2021 International Conference on Computational Performance Evaluation (ComPE)

  2. 2
    مؤتمر

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1286-1292 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

  3. 3
    مؤتمر

    المصدر: 2021 2nd International Conference on Smart Electronics and Communication (ICOSEC) Smart Electronics and Communication (ICOSEC), 2021 2nd International Conference on. :710-712 Oct, 2021

    Relation: 2021 2nd International Conference on Smart Electronics and Communication (ICOSEC)

  4. 4
    مؤتمر

    المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2020 IEEE Electrical Design of. :1-3 Dec, 2020

    Relation: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

  5. 5
    مؤتمر

    المصدر: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019 IEEE 28th Conference on. :1-3 Oct, 2019

    Relation: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

  6. 6
    مؤتمر

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2180-2185 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

  7. 7
    مؤتمر

    المصدر: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018 IEEE. :1-3 Dec, 2018

    Relation: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

  8. 8
    مؤتمر

    المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :151-153 Oct, 2018

    Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

  9. 9
    كتاب إلكتروني

    المساهمون: Kacprzyk, Janusz, Series EditorAff1, Pal, Nikhil R., Advisory EditorAff2, Bello Perez, Rafael, Advisory EditorAff3, Corchado, Emilio S., Advisory EditorAff4, Hagras, Hani, Advisory EditorAff5, Kóczy, László T., Advisory EditorAff6, Kreinovich, Vladik, Advisory EditorAff7, Lin, Chin-Teng, Advisory EditorAff8, Lu, Jie, Advisory EditorAff9, Melin, Patricia, Advisory EditorAff10, Nedjah, Nadia, Advisory EditorAff11, Nguyen, Ngoc Thanh, Advisory EditorAff12, Wang, Jun, Advisory EditorAff13, Reddy, V. Sivakumar, editorAff14, Prasad, V. Kamakshi, editorAff15, Wang, Jiacun, editorAff16, Reddy, K.T.V., editorAff17

    المصدر: Soft Computing and Signal Processing : Proceedings of 4th ICSCSP 2021. 1413:219-237

  10. 10
    مؤتمر

    المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :368-373 May, 2016

    Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)