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1مؤتمر
المؤلفون: Shanavas, T N, Bharath, Krishna K, Sunny, Anglight, Anju, P M, Rajeev, Aman
المصدر: 2021 International Conference on Computational Performance Evaluation (ComPE) Computational Performance Evaluation (ComPE), 2021 International Conference on. :810-814 Dec, 2021
Relation: 2021 International Conference on Computational Performance Evaluation (ComPE)
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2مؤتمر
المؤلفون: Bharath, Krishna, Radhakrishnan, Kaladhar, Hill, Michael J., Chatterjee, Prithwish, Hariri, Haifa, Venkataraman, Srikrishnan, Do, Huong T., Wojewoda, Leigh, Srinivasan, Sriram
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1286-1292 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المصدر: 2021 2nd International Conference on Smart Electronics and Communication (ICOSEC) Smart Electronics and Communication (ICOSEC), 2021 2nd International Conference on. :710-712 Oct, 2021
Relation: 2021 2nd International Conference on Smart Electronics and Communication (ICOSEC)
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4مؤتمر
المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2020 IEEE Electrical Design of. :1-3 Dec, 2020
Relation: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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5مؤتمر
المؤلفون: Govindan, Srinivasan, Bharath, Krishna, Gope, Dipanjan, Venkataraman, Srikrishnan, Ambasana, Nikita
المصدر: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019 IEEE 28th Conference on. :1-3 Oct, 2019
Relation: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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6مؤتمر
المؤلفون: Chandrasekhar, Arun, Boddu, Vijaya, Chuh, Erich, Bharath, Krishna, Yahyaei-Moayyed, Farzaneh, Venkataraman, Srikrishnan, Srinivasan, Sriram, Viswanath, Ram, Kalyanam, Huthasana, Jain, Ritesh
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2180-2185 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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7مؤتمر
المصدر: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018 IEEE. :1-3 Dec, 2018
Relation: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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8مؤتمر
المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :151-153 Oct, 2018
Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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9كتاب إلكتروني
المؤلفون: Reddy, Y. Vijay BhaskarAff18, Adusumalli, VyshnaviAff18, Boggavarapu, Venkata Bharath KrishnaAff18, Bale, Mahesh BabuAff18, Challa, ArchanaAff18
المساهمون: Kacprzyk, Janusz, Series EditorAff1, Pal, Nikhil R., Advisory EditorAff2, Bello Perez, Rafael, Advisory EditorAff3, Corchado, Emilio S., Advisory EditorAff4, Hagras, Hani, Advisory EditorAff5, Kóczy, László T., Advisory EditorAff6, Kreinovich, Vladik, Advisory EditorAff7, Lin, Chin-Teng, Advisory EditorAff8, Lu, Jie, Advisory EditorAff9, Melin, Patricia, Advisory EditorAff10, Nedjah, Nadia, Advisory EditorAff11, Nguyen, Ngoc Thanh, Advisory EditorAff12, Wang, Jun, Advisory EditorAff13, Reddy, V. Sivakumar, editorAff14, Prasad, V. Kamakshi, editorAff15, Wang, Jiacun, editorAff16, Reddy, K.T.V., editorAff17
المصدر: Soft Computing and Signal Processing : Proceedings of 4th ICSCSP 2021. 1413:219-237
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10مؤتمر
المؤلفون: Bharath, Krishna, Venkataraman, Srikrishnan
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :368-373 May, 2016
Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)