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1مؤتمر
المؤلفون: Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Scheer, Achim, Binner, Ralph, Peters, Henk
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2مؤتمر
المؤلفون: Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Ackermann, Thomas, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Binner, Ralph, Peters, Henk, Scheer, Achim, Chee, Vincent
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :489-494 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)