يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Birlem Olav"', وقت الاستعلام: 0.87s تنقيح النتائج
  1. 1
    مؤتمر
    Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration

    المؤلفون: Bickel, Steffen, Quednau, Sebastian, Birlem, Olav, Panchenko, Juliana, Junghahnel, Manuela

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1376-1381 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    دورية أكاديمية
    Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

    المؤلفون: Bickel, SteffenAff1, IDs11664024111078_cor1, Quednau, Sebastian, Birlem, Olav, Graff, Andreas, Altmann, Frank, Junghähnel, Manuela, Panchenko, JulianaAff1, Aff4

    المصدر: Journal of Electronic Materials. 53(8):4410-4420

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration

    المؤلفون: Shehzad, Adil, Yin, Ran, Panchenko, Iuliana, Muller, Maik, Bickel, Steffen, Birlem, Olav, Quednau, Sebastian, Wolf, Jurgen M.

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :118-123 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

    أضف إلى المفضلة
  4. 4
    مؤتمر
    Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates

    المؤلفون: Yu, Zechun, Tan, Ying Zhao, Bayer, Christoph F., Rauh, Hubert, Schletz, Andreas, Marz, Martin, Birlem, Olav

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :1-7 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    Room Temperature KlettWelding Interconnect Technology for High Performance CMOS Logic

    المؤلفون: Roustaie, Farough, Quednau, Sebastian, Weissenborn, Florian, Birlem, Olav, Riehl, David, Ding, Xiang, Kramer, Andreas, Hofmann, Klaus

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :371-376 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    Room Temperature KlettWelding Interconnect Technology for High Performance CMOS Logic

    المؤلفون: Xiang Ding, Florian Weissenborn, Birlem Olav, Roustaie Farough, Klaus Hofmann, David Riehl, Andreas Kramer, Sebastian Quednau

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

    مصطلحات موضوعية: Materials science, business.industry, Nanowire, 7. Clean energy, Temperature measurement, Die (integrated circuit), law.invention, CMOS, law, MOSFET, Optoelectronics, Wafer, business, Diode, Light-emitting diode

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fd80c756cf5f9f44d1785fe9729c72d3
    https://doi.org/10.1109/ectc32696.2021.00069

    أضف إلى المفضلة
  7. 7
    Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

    المؤلفون: Farough Roustaie, Quednau, Sebastian, Dassinger, Florian, Birlem, Olav

    مصطلحات موضوعية: Electronic Packaging, Nanotechnology, KlettWelding, Nanowire, AIT, 7. Clean energy

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::56f48f8b21ff4c41b0f7253a331eb9f5

    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء