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1مؤتمر
المؤلفون: Bickel, Steffen, Quednau, Sebastian, Birlem, Olav, Panchenko, Juliana, Junghahnel, Manuela
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1376-1381 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2دورية أكاديمية
المؤلفون: Bickel, SteffenAff1, IDs11664024111078_cor1, Quednau, Sebastian, Birlem, Olav, Graff, Andreas, Altmann, Frank, Junghähnel, Manuela, Panchenko, JulianaAff1, Aff4
المصدر: Journal of Electronic Materials. 53(8):4410-4420
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3مؤتمر
المؤلفون: Shehzad, Adil, Yin, Ran, Panchenko, Iuliana, Muller, Maik, Bickel, Steffen, Birlem, Olav, Quednau, Sebastian, Wolf, Jurgen M.
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :118-123 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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4مؤتمر
المؤلفون: Yu, Zechun, Tan, Ying Zhao, Bayer, Christoph F., Rauh, Hubert, Schletz, Andreas, Marz, Martin, Birlem, Olav
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :1-7 Dec, 2021
Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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5مؤتمر
المؤلفون: Roustaie, Farough, Quednau, Sebastian, Weissenborn, Florian, Birlem, Olav, Riehl, David, Ding, Xiang, Kramer, Andreas, Hofmann, Klaus
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :371-376 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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المؤلفون: Xiang Ding, Florian Weissenborn, Birlem Olav, Roustaie Farough, Klaus Hofmann, David Riehl, Andreas Kramer, Sebastian Quednau
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, business.industry, Nanowire, 7. Clean energy, Temperature measurement, Die (integrated circuit), law.invention, CMOS, law, MOSFET, Optoelectronics, Wafer, business, Diode, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fd80c756cf5f9f44d1785fe9729c72d3
https://doi.org/10.1109/ectc32696.2021.00069 -
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