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1مؤتمرDemonstration of Eight Metal Layer Redistribution on Glass Substrate with Fine Features and Microvia
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1744-1748 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Bhaskar, Pragna, Kathaperumal, Mohan, Blancher, Christopher, Losego, Mark, Swaminathan, Madhavan
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :49-53 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3دورية أكاديمية
المؤلفون: Amory, S., Dugoujon, J.-M., Despiau, S., Roubinet, F., El-Chennawi, F., Blancher, A.
المصدر: Bulletins et mémoires de la société d’anthropologie de ParisOpenAIRE.
مصطلحات موضوعية: allèle O, Berbère, polymorphisme, Berber, O allele, polymorphism
Relation: http://journals.openedition.org/bmsap/basictei/1188; http://journals.openedition.org/bmsap/tei/1188
URL الوصول: http://journals.openedition.org/bmsap/1188
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4مؤتمر
المؤلفون: Kathaperumal, Mohan, Nie, Bai, Bhaskar, Pragna, Blancher, Christopher, Nimbalkar, Pratik, Liu, Fuhan, Swaminathan, Madhavan
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1674-1679 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Bhaskar, Pragna, Blancher, Christopher, Kathaperumal, Mohan, Swaminathan, Madhavan, Losego, Mark D.
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :62-66 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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6مؤتمر
المؤلفون: Nimbalkar, Pratik, Bhaskar, Pragna, Blancher, Christopher, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2168-2173 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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7دورية أكاديمية
المؤلفون: Raphael Blancher
المصدر: Nomadic Peoples, Vol 28, Iss 1, Pp 143-147 (2024)
مصطلحات موضوعية: Ethnology. Social and cultural anthropology, GN301-674
وصف الملف: electronic resource
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8دورية أكاديمية
المؤلفون: Nimbalkar, P., Blancher, C., Kathaperumal, M., Swaminathan, M., Tummala, R.
المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(1):59-64 Mar, 2022
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9دورية أكاديمية
المؤلفون: Segond, N., Viglino, D., Duhem, H., Vigneron, C., Vallot, C., Brenckmann, V., Blancher, M., Versini, S., Serruys, A., Savary, D., Bellier, A., Debaty, G.
المصدر: In American Journal of Emergency Medicine July 2024 81:47-52
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10دورية أكاديمية
المؤلفون: Trouche-Estival, Benjamin, Vitte, Joana, Martin-Blondel, Audrey, Michelet, Marine, Gruzelle, Vianney, Didier, Alain, Guilleminault, Laurent, Mailhol, Claire, Rivera, Silvia Martinez, De Lima Correia, Anaïs, Taurus, Camille, Blancher, Antoine, Goret, Julien, Klingebiel, Caroline, Apoil, Pol André
المصدر: In The Journal of Allergy and Clinical Immunology: In Practice June 2024 12(6):1605-1613