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1مؤتمرDemonstration of Eight Metal Layer Redistribution on Glass Substrate with Fine Features and Microvia
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1744-1748 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Bhaskar, Pragna, Kathaperumal, Mohan, Blancher, Christopher, Losego, Mark, Swaminathan, Madhavan
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :49-53 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المؤلفون: Kathaperumal, Mohan, Nie, Bai, Bhaskar, Pragna, Blancher, Christopher, Nimbalkar, Pratik, Liu, Fuhan, Swaminathan, Madhavan
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1674-1679 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Bhaskar, Pragna, Blancher, Christopher, Kathaperumal, Mohan, Swaminathan, Madhavan, Losego, Mark D.
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :62-66 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Nimbalkar, Pratik, Bhaskar, Pragna, Blancher, Christopher, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2168-2173 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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6دورية أكاديمية
المؤلفون: Nimbalkar, Pratik, Blancher, Christopher, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao
المصدر: IEEE Transactions on Device & Materials Reliability; Mar2022, Vol. 22 Issue 1, p59-64, 6p