يعرض 1 - 10 نتائج من 282 نتيجة بحث عن '"Blech"', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    مؤتمر
    Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects

    المؤلفون: Zhang, Z., Kraatz, M., Hauschildt, M., Choi, S., Clausner, A., Zschech, E., Gall, M.

    المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021

    Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

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  2. 2
    مؤتمر
    The Blech effect revisited – an in-situ study

    المؤلفون: Lin, Shih-kang, Liu, Yu-chen, Lin, Kuan-hsueh

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :205-206 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Predicting electromigration mortality under temperature and product lifetime specifications

    المؤلفون: Mishra, Vivek, Sapatnekar, Sachin S.

    المصدر: 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2016 53nd ACM/EDAC/IEEE. :1-6 Jun, 2016

    Relation: 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

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  4. 4
    مؤتمر
    Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling

    المؤلفون: Kraatz, M., Sander, C., Clausner, A., Hauschildt, M., Standke, Y., Gall, M., Zschech, E.

    المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :4F.2-1-4F.2-4 Mar, 2018

    Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)

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  5. 5
    دورية أكاديمية
    Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films

    المؤلفون: Somaiah, Nalla, Kumar, PraveenAff1

    المصدر: Journal of Electronic Materials. 49(1):96-108

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  6. 6
    دورية أكاديمية
    An Electromigration Failure Distribution Model for Short-Length Conductors Incorporating Passive Sinks/Reservoirs

    المؤلفون: Lin, M. H., Oates, A. S.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 13(1):322-326 Mar, 2013

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  7. 7
    دورية أكاديمية
    Electromigration Failure Distributions of Cu/Low-$k$ Dual-Damascene Vias: Impact of the Critical Current Density and a New Reliability Extrapolation Methodology

    المؤلفون: Oates, A. S., Lin, M. H.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 9(2):244-254 Jun, 2009

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  8. 8
    دورية أكاديمية
    Stress-induced electromigration backflow effect in copper interconnects

    المؤلفون: Ney, D., Federspiel, X., Girault, V., Thomas, O., Gergaud, P.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 6(2):175-180 Jun, 2006

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  9. 9
    مؤتمر
    Comparison of electromigration behaviors of SnAg and SnCu solders

    المؤلفون: Lu, Minhua, Shih, Da-Yuan, Goldsmith, Charles, Wassick, Thomas

    المصدر: 2009 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2009 IEEE International. :149-154 Apr, 2009

    Relation: 2009 IEEE International Reliability Physics Symposium (IRPS)

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  10. 10
    مؤتمر
    Temperature scaling of electromigration threshold product in Cu/low-K interconnects

    المؤلفون: Petitprez, E., Doyen, L., Ney, D.

    المصدر: 2009 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2009 IEEE International. :865-868 Apr, 2009

    Relation: 2009 IEEE International Reliability Physics Symposium (IRPS)

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