المؤلفون: Laguerre, J., Martin, S., Coignus, J., Carabasse, C., Bocquet, M., Andrieu, F., Grenouillet, L.

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-7 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Turck, C., Bonnet, D., Harabi, K.-E., Dalgaty, T., Ballet, T., Hirtzlin, T., Pontlevy, A., Renaudineau, A., Esmanhotto, E., Bessiere, P., Droulez, J., Laurent, R., Bocquet, M., Portal, J.-M., Vianello, E., Querlioz, D.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Laguerre, J., Bocquet, M., Billoint, O., Martin, S., Coignus, J., Carabasse, C., Magis, T., Dewolf, T., Andrieu, F., Grenouillet, L.

المصدر: 2023 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2023 IEEE International. :1-4 May, 2023

Relation: 2023 IEEE International Memory Workshop (IMW)

المؤلفون: Loyez, C., Bocquet, M., Rolland, N., Haddadi, K.

المصدر: IEEE Open Journal of Instrumentation and Measurement IEEE Open J. Instrum. Meas. Instrumentation and Measurement, IEEE Open Journal of. 2:1-7 2023

المؤلفون: Lopez, J. Minguet, Rummens, F., Reganaz, L., Heraud, A., Hirtzlin, T., Grenouillet, L., Navarro, G., Bernard, M., Carabasse, C., Castellani, N., Meli, V., Martin, S., Magis, T., Vianello, E., Sabbione, C., Deleruyelle, D., Bocquet, M., Portal, J. M., Molas, G., Andrieu, F.

المصدر: 2022 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2022 IEEE International. :1-4 May, 2022

Relation: 2022 IEEE International Memory Workshop (IMW)

المؤلفون: Renaudineau, A., Harabi, K.-E., Turck, C., Laborieux, A., Vianello, E., Bocquet, M., Portal, J.-M., Querlioz, D.

المصدر: 2023 Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2023. :43-44 Jun, 2023

Relation: 2023 Silicon Nanoelectronics Workshop (SNW)

المؤلفون: Jebali, F., Muhr, E., Alayan, M., Faye, M.C., Querlioz, D., Andrieu, F., Vianello, E., Molas, G., Bocquet, M., Portal, J.M.

المصدر: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2022 IEEE 34th International Conference on. :1-5 Mar, 2022

Relation: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Turck, C., Harabi, K.-E., Hirtzlin, T., Vianello, E., Laurent, R., Droulez, J., Bessiere, P., Bocquet, M., Portal, J.-M., Querlioz, D.

المصدر: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2023. :1-2 Apr, 2023

Relation: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE)

المؤلفون: Ezzadeen, M., Majumdar, A., Bocquet, M., Giraud, B., Noel, J.-P., Andrieu, F., Querlioz, D., Portal, J.-M.

المصدر: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2021 - IEEE 51st European. :83-86 Sep, 2021

Relation: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Jebali, F., Majumdar, A., Laborieux, A., Hirtzlin, T., Vianello, E., Walder, J.P., Bocquet, M., Querlioz, D., Portal, J. M.

المصدر: 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2021 IEEE International Midwest Symposium on. :158-161 Aug, 2021

Relation: 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)