المؤلفون: Chen, F., Chanda, K., Gill, J., Angyal, M., Demarest, J., Sullivan, T., Kontra, R., Shinosky, M., Li, J., Economikos, L., Hoinkis, M., Lane, S., McHerron, D., Inohara, M., Boettcher, S., Dunn, D., Fukasawa, M., Zhang, B.C., Ida, K., Ema, T., Lembach, G., Kumar, K., Lin, Y., Maynard, H., Urata, K., Bolom, T., Inoue, K., Smith, J., Ishikawa, Y., Naujok, M., Ong, P., Sakamoto, A., Hunt, D., Aitken, J.

المصدر: 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. Reliability physics Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International. :501-507 2005

Relation: 2005 IEEE International Reliability Physics Symposium. Proceedings 43rd Annual

المؤلفون: Nogami, T., He, M., Zhang, X., Tanwar, K., Patlolla, R., Kelly, J., Rath, D., Krishnan, M., Lin, X., Straten, O., Shobha, H., Li, J., Madan, A., Flaitz, P., Parks, C., Hu, C-K., Penny, C., Simon, A., Bolom, T., Maniscalco, J., Canaperi, D., Spooner, T., Edelstein, D.

المصدر: 2013 IEEE International Interconnect Technology Conference - IITC Interconnect Technology Conference (IITC), 2013 IEEE International. :1-3 Jun, 2013

Relation: 2013 IEEE International Interconnect Technology Conference - IITC

المؤلفون: Nogami, T., Maniscalco, J., Madan, A., Flaitz, P., DeHaven, P., Parks, C., Tai, L., Lawrence, B. St., Davis, R., Murphy, R., Shaw, T., Cohen, S., Hu, C-K., Cabral, C., Chiang, S., Kelly, J., Zaitz, M., Schmatz, J., Choi, S., Tsumura, K., Penny, C., Chen, H-C., Canaperi, D., Vo, T., Ito, F., Straten, O., Simon, A., Rhee, S-H., Kim, B-Y., Bolom, T., Ryan, V., Ma, P., Ren, J., Aubuchon, J., Fine, J., Kozlowski, P., Spooner, T., Edelstein, D.

المصدر: 2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010

Relation: 2010 IEEE International Interconnect Technology Conference - IITC

المؤلفون: Fischer, A.H., Aubel, O., Gill, J., Lee, T.C., Li, B., Christiansen, C., Chen, F., Angyal, M., Bolom, T., Kaltalioglu, E.

المصدر: 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual Reliability physics symposium, 2007. proceedings. 45th annual. ieee international. :511-515 Apr, 2007

Relation: 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual

المؤلفون: Sankaran, S., Arai, S., Augur, R., Beck, M., Biery, G., Bolom, T., Bonilla, G., Bravo, O., Chanda, K., Chae, M., Chen, F., Clevenger, L., Cohen, S., Cowley, A., Davis, P., Demarest, J., Doyle, J., Dimitrakopoulos, C., Economikos, L., Edelstein, D., Farooq, M., Filippi, R., Fitzsimmons, J., Fuller, N., Gates, S. M., Greco, S. E., Grill, A., Grunow, S., Hannon, R., Ida, K., Jung, D., Kaltalioglu, E., Kelling, M., Ko, T., Kumar, K., Labelle, C., Landis, H., Lane, M.W., Landers, W., Lee, M., Li, W., Liniger, E., Liu, X., Lloyd, J. R., Liu, W., Lustig, N., Malone, K., Marokkey, S., Matusiewicz, G., McLaughlin, P. S., McLaughlin, P. V., Mehta, S., Melville, I., Miyata, K., Moon, B., Nitta, S., Nguyen, D., Nicholson, L., Nielsen, D., Ong, P., Patel, K., Patel, V., Park, W., Pellerin, J., Ponoth, S., Petrarca, K., Rath, D., Restaino, D., Rhee, S., Ryan, E.T., Shoba, H., Simon, A., Simonyi, E., Shaw, T.M., Spooner, T., Standaert, T., Sucharitaves, J., Tian, C., Wendt, H., Werking, J., Widodo, J., Wiggins, L., Wisnieff, R., Ivers, T.

المصدر: 2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006

Relation: 2006 International Electron Devices Meeting

المؤلفون: Goldberg, C., Park, S.H., Kim, B.Y., Law, S.B., Hamieh, B., Jung, J., Kim, B.H., Rhee, S.H., Oh, M., Mobley, M., Laffosse, E., Kim, A., Thomas, A., Malinge, P., Fryxell, T., Lim, K.J., Park, I.S., Bahierathan, B., Wu, F., Erenturk, B., Jeon, W.C., Choi, H.C., Park, Y.J., Kim, H., Chen, T.Q., Thibaut, S., Niu, C., Zhang, J., Filippi, R., Kaltalioglu, E., Achanta, R., Wang, P.-C., Yang, H., Geronimi, J.P., Pagette, F., Chauhan, V., Ogino, A., Srivastava, R., Koshy, R., Baumann, F., Simon, A., Nag, J., Cheng, T., Fitzsimmons, J., Tseng, W., Lin, Y., Sun, Z., Bolom, T., Ko, T.-M., Clevenger, L., Kim, J, Sudijono, J., Sampson, R.

المصدر: 2013 Symposium on VLSI Technology VLSI Technology (VLSIT), 2013 Symposium on. :T202-T203 Jun, 2013

Relation: 2013 Symposium on VLSI Technology

المؤلفون: Simon, A.H., Bolom, T., Niu, C., Baumann, F. H., Hu, C.-K., Parks, C., Nag, J., Kim, H., Lee, J.Y., Yang, C.-C., Nguyen, S., Shobha, H.K., Nogami, T., Guggilla, S., Ren, J., Sabens, D., AuBuchon, J.F.

المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2013 IEEE International. :3F.4.1-3F.4.6 Apr, 2013

Relation: 2013 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Nogami, T., Penny, C., Madan, A., Parks, C., Li, J., Flaitz, P., Uedono, A., Chiang, S., He, M., Simon, A., Bolom, T., Ryan, T., Ito, F., Christiansen, C., Tai, L., Hu, C-K., Kim, H., Zhang, X., Tanwar, K., Choi, S., Baumann, F., Davis, R., Kelly, J., Murphy, R., Molis, S., Rowland, J., Dehaven, P., Canaperi, D., Spooner, T., Edelstein, D.

المصدر: 2012 International Electron Devices Meeting Electron Devices Meeting (IEDM), 2012 IEEE International. :33.7.1-33.7.4 Dec, 2012

Relation: 2012 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Nogami, T., Bolom, T., Simon, A., Kim, B-Y., Hu, C-K., Tsumura, K., Madan, A., Baumann, F., Wang, Y., Flaitz, P., Parks, C., DeHaven, P., Davis, R., Zaitz, M., Lawrence, B. St., Murphy, R., Tai, L., Molis, S., Rhee, S-H., Usui, T., Cabral, C., Maniscalco, J., Clevenger, L., Li, B., Christiansen, C., Chen, F., Lee, T., Schmatz, J., Shobha, H., Ito, F., Ryan, T., Nguyen, S., Canaperi, D., Arnold, J., Choi, S., Cohen, S., Liniger, E., Chen, H-C., Chen, S-T., Vo, T., Kelly, J., Straten, O., Penny, C., Bonilla, G., Kozlowski, P., Spooner, T., Edelstein, D.

المصدر: 2010 International Electron Devices Meeting Electron Devices Meeting (IEDM), 2010 IEEE International. :33.5.1-33.5.4 Dec, 2010

Relation: 2010 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Augur, R., Child, C., Ahn, J.H., Tang, T.J., Clevenger, L., Kioussis, D., Masuda, H., Srivastava, R., Oda, Y., Oguma, H., Quon, R., Kim, B., Sheng, H., Hirooka, S., Gupta, R., Thomas, A., Singh, S.M., Fang, Q., Schiwon, R., Hamieh, B., Wornyo, E., Allen, S., Kaltalioglu, E., Ribes, G., Zhang, G., Fryxell, T., Ogino, A., Shimada, E., Aizawa, H., Minda, H., Kim, S.O., Oki, T., Fujii, K., Pallachalil, M., Takewaki, T., Hu, C.K., Sundlof, B., Permana, D., Bolom, T., Engel, B., Labelle, C., Sapp, B., Nogami, T., Simon, A., Shobha, H., Gates, S., Ryan, E.T., Bonilla, G., Daubenspeck, T., Shaw, T., Osborne, G., Grill, A., Edelstein, D., Restaino, D., Molis, S., Spooner, T., Ferreira, P., Biery, G., Sampson, R.

المصدر: In Microelectronic Engineering April 2012 92:42-44