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1مؤتمر
المؤلفون: Lai, Yangyang, X, Jiefeng, Ha, Jonghwan, Deo, Karthik A, Yang, Junbo, Park, Seungbae
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1538-1542 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Chee, Choong Kooi, Hsu, Sean, Patel, Janak, Bamido, Alaba
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :929-934 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المصدر: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2023 39th. :1-4 Mar, 2023
Relation: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
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4دورية أكاديمية
المؤلفون: Yeo, S.M., Yow, H., Yeoh, K.H., Ishak, S.H.b.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1410-1420 Aug, 2022
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5دورية أكاديمية
المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 71:1-10 2022
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6مؤتمر
المؤلفون: Shia, David, Yang, Jin
المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :158-165 Jul, 2020
Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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7مؤتمر
المؤلفون: Ruifen, Zhang, Nantes, Donald, Lingling, Teo
المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :543-547 Dec, 2019
Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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8مؤتمر
المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-6 Sep, 2019
Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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9دورية أكاديمية
المؤلفون: Sourav Banerjee, Vahid Tavaf, Mustahseen M. Indaleeb
المصدر: Journal of Composites Science, Vol 8, Iss 3, p 107 (2024)
مصطلحات موضوعية: adhesive bonding, NDE, nondestructive evaluation, ultrasonic NDE, bond line NDE, composite bond, Technology, Science
وصف الملف: electronic resource
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10دورية أكاديمية
المؤلفون: Hansson, J., Nilsson, T.M.J., Ye, L., Liu, J.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(6):1045-1053 Jun, 2019