يعرض 1 - 10 نتائج من 31 نتيجة بحث عن '"Boon-Khim Liew"', وقت الاستعلام: 1.02s تنقيح النتائج
  1. 1
    مؤتمر
    An analytical model of positive HBM ESD current distribution and the modified multi-finger protection structure

    المؤلفون: Jian-Hsing Lee, Jiaw-Ren Shih, Yi-Hsun Wu, Boon-Khim Liew, Huey-Liang Hwang

    المصدر: Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the. :162-167 1999

    Relation: Proceedings of 7th International Symposium on Physical and Failure Analysis of Integrated Circuits

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  2. 2
    دورية أكاديمية
    Modeling and optimization of substrate resistance for RF-CMOS

    المؤلفون: Chang, R.T., Ming-Ta Yang, Ho, P.P.C., Yo-Jen Wang, Yu-Tai Chia, Boon-Khim Liew, Yue, C.P., Wong, S.S.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(3):421-426 Mar, 2004

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  3. 3
    دورية أكاديمية
    Arsenic/phosphorus LDD optimization by taking advantage of phosphorus transient enhanced diffusion for high voltage input/output CMOS devices

    المؤلفون: Wang, H.C.-H., Chih-Chiang Wang, Diaz, C.H., Boon-Khim Liew, Sun, J.Y.-C., Tahui Wang

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 49(1):67-71 Jan, 2002

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  4. 4
    مؤتمر
    Analysis of interconnect delay for 0.18 /spl mu/m technology and beyond

    المؤلفون: Shien-Yang Wu, Boon-Khim Liew, Young, K.L., Yu, C.H., Sun, S.C.

    المصدر: Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :68-70 1999

    Relation: Proceedings of the IEEE 1999 International Interconnect Technology Conference

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  5. 5
    دورية أكاديمية
    Characteristics of deep-submicrometer MOSFET and its empirical nonlinear RF model

    المؤلفون: Yi-Jen Chan, Chia-Hung Huang, Chung-Chian Weng, Boon-Khim Liew

    المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 46(5):611-615 May, 1998

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  6. 6
    دورية أكاديمية
    Hot carrier reliability improvement by utilizing phosphorus transient enhanced diffusion for input/output devices of deep submicron CMOS technology

    المؤلفون: Wang, H.H.-C., Diaz, C.H., Boon-Khim Liew, Sun, J.Y.-C., Tahui Wang

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 21(12):598-600 Dec, 2000

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  7. 7
    مؤتمر
    Circuit reliability of hot electron induced degradation in high speed CMOS SRAM

    المؤلفون: Boon-Khim Liew, Alvarez, A.R.

    المصدر: Proceedings of IEEE Custom Integrated Circuits Conference - CICC '93 Custom integrated circuits Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993. :30.2.1-30.2.4 1993

    Relation: Proceedings of IEEE Custom Integrated Circuits Conference - CICC '93

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  8. 8
    Systematic co-optimization from chip design, process technology to systems for GPU AI chip

    المؤلفون: Boon-khim Liew, Lianxi Shen, Yanfeng Wang, James Chen, Lin Cong, John R Hu

    المصدر: VLSI-DAT

    مصطلحات موضوعية: 0209 industrial biotechnology, Computer science, business.industry, Time to market, Process (computing), 02 engineering and technology, Integrated circuit design, Chip, Supercomputer, Design for manufacturability, 020901 industrial engineering & automation, Reliability (semiconductor), Embedded system, Design process, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::673d9ee8cc2976d1c64d8ba64ce555ef
    https://doi.org/10.1109/vlsi-tsa.2018.8403802

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  9. 9
    Modeling and Optimization of Substrate Resistance for RF-CMOS

    المؤلفون: Pei-i Ho, Yo-Jen Wang, S. Simon Wong, Boon-Khim Liew, M.T. Yang, Chik Patrick Yue, Yu-Tai Chia, R.T. Chang

    المصدر: IEEE Transactions on Electron Devices. 51:421-426

    مصطلحات موضوعية: Substrate coupling, Materials science, Contact resistance, Transistor, Hardware_PERFORMANCEANDRELIABILITY, Substrate (printing), equipment and supplies, Electronic, Optical and Magnetic Materials, law.invention, Integrated injection logic, CMOS, law, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Output impedance, Radio frequency, Electrical and Electronic Engineering

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9108b71199d518a31bbb3d7700d4b907
    https://doi.org/10.1109/ted.2003.822586

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  10. 10
    Arsenic/phosphorus LDD optimization by taking advantage of phosphorus transient enhanced diffusion for high voltage input/output CMOS devices

    المؤلفون: Chih-Chiang Wang, J.Y.-C. Sun, H.C.-H. Wang, Boon-Khim Liew, Carlos H. Diaz, Tahui Wang

    المصدر: IEEE Transactions on Electron Devices. 49:67-71

    مصطلحات موضوعية: Materials science, business.industry, Phosphorus, Transistor, Analytical chemistry, chemistry.chemical_element, High voltage, Electronic, Optical and Magnetic Materials, law.invention, Secondary ion mass spectrometry, CMOS, chemistry, law, Electric field, MOSFET, Optoelectronics, Transient (oscillation), Electrical and Electronic Engineering, business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a5cd4b31fbd3b1a1896b709f9656e80f
    https://doi.org/10.1109/16.974751

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