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1مؤتمر
المؤلفون: Bortesi, L, Vendrame, L., Fantini, P., Spessot, A., Lacaita, A. L.
المصدر: 2012 IEEE International Conference on Microelectronic Test Structures Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on. :229-232 Mar, 2012
Relation: 2012 IEEE International Conference on Microelectronic Test Structures (ICMTS)
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2مؤتمر
المؤلفون: Bortesi, L., Vendrame, L., Fontana, G.
المصدر: 2010 International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2010 IEEE International Conference on. :226-230 Mar, 2010
Relation: 2010 International Conference on Microelectronic Test Structures (ICMTS)
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3دورية أكاديمية
المؤلفون: Buyel, J. F.Aff1, Aff2, Stöger, E., Bortesi, L.
المصدر: Transgenic Research: Associated with the International Society for Transgenic Technologies (ISTT). 30(4):401-426
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4مؤتمر
المؤلفون: Vendrame, L., Bortesi, L., Bogliolo, A.
المصدر: Proceedings of the 2005 International Conference on Microelectronic Test Structures, 2005. ICMTS 2005. Microelectronic Test Structures Microelectronic Test Structures, 2005. ICMTS 2005. Proceedings of the 2005 International Conference on. :257-261 2005
Relation: ICMTS 2005. Proceedings of the 2005 International Conference on Microelectronic Test Structures
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5مؤتمر
المؤلفون: Vendrame, L., Bortesi, L., Biasio, M., Meneghesso, G.
المصدر: Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Signal Propagation on Interconnects Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on. :139-142 2005
Relation: Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects
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6دورية أكاديمية
المؤلفون: Vendrame, L., Bortesi, L., Cattane, F., Bogliolo, A.
المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 19(1):67-77 Feb, 2006
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7دورية أكاديمية
المؤلفون: Brambilla, A., Maffezzoni, P., Bortesi, L., Vendrame, L.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 50(11):2236-2247 Nov, 2003
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8مؤتمر
المؤلفون: Mennillo, S., Spessot, A., Vendrame, L., Bortesi, L.
المصدر: 2009 IEEE International Conference on Microelectronic Test Structures Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on. :56-61 Mar, 2009
Relation: 2009 IEEE International Conference on Microelectronic Test Structures (ICMTS)
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9مؤتمرMetal and Dielectric Thickness: a Comprehensive Methodology for Back-End Electrical Characterization
المؤلفون: Bortesi, L., Vendrame, L.
المصدر: 2009 IEEE International Conference on Microelectronic Test Structures Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on. :196-200 Mar, 2009
Relation: 2009 IEEE International Conference on Microelectronic Test Structures (ICMTS)
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10مؤتمر
المؤلفون: Bogliolo, A., Vendrame, L., Bortesi, L., Barachetti, E.
المصدر: Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings. :75-77 2002
Relation: 6th IEEE Workshop on Signal Propagation on Interconnects
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