المؤلفون: Riahi, S., Becan, G., Ammar, M., Bosseboeuf, A., Laourine, F., Boutaud, B., Bouville, D., Harouri, A., Coste, P., Lefeuvre, E.

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Lackner Jules, Fix Baptiste, Bosseboeuf Alain, Bouchon Patrick

المصدر: EPJ Web of Conferences, Vol 287, p 04013 (2023)

مصطلحات موضوعية: Physics, QC1-999

وصف الملف: electronic resource

Relation: https://www.epj-conferences.org/articles/epjconf/pdf/2023/13/epjconf_eosam2023_04013.pdf; https://doaj.org/toc/2100-014X

URL الوصول: https://doaj.org/article/bcce5cc949c94cd092fa40e120ab3cc7

المؤلفون: Lemettre, Sylvain, Bessouet, Clement, Kutyla, Charlotte, Bosseboeuf, Alain, Coste, Philippe, Sauvage, Thierry, Lecoq, Helene, Wendling, Olivier, Bellamy, Aurelien, Moulin, Johan

المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-4 May, 2023

Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Guerreiro, Sara, Bainschab, Markus, Piot, Adrien, Rocha, Rodrigo Tumolin, Toshiyoshi, Hiroshi, Bosseboeuf, Alain, Sasaki, Takashi, Lagosh, Anton, Moridi, Mohssen

المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-6 May, 2023

Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Kutyla, Charlotte, Lemettre, Sylvain, Bessouet, Clement, Bosseboeuf, Alain, Coste, Philippe, Sauvage, Thierry, Wendling, Olivier, Bellamy, Aurelien, Jagtap, Piyush, Escoubas, Stephanie, Guichet, Christophe, Thomas, Olivier, Moulin, Johan

المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-4 Jul, 2022

Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Hudeley, Lucas, Traon, Olivier Le, Perrier, Thomas, Levy, Raphael, Guerard, Jean, Bosseboeuf, Alain

المصدر: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) Inertial Sensors and Systems (INERTIAL), 2022 IEEE International Symposium on. :1-4 May, 2022

Relation: 2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)

المؤلفون: Becan, G., Bosseboeuf, A., Phung, J., Philippe, H., Boutaud, B., Woytasik, M., Coste, P., Lefeuvre, E.

المصدر: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2021 Symposium on. :1-5 Aug, 2021

Relation: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Blanc, Lucas, Parrain, Fabien, Chaillot, Agnes, Woytasik, Marion, Maire, Olivier, Bosseboeuf, Alain

المصدر: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-6 Jun, 2020

Relation: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Becan, G., Phung, J., Philippe, H., Bosseboeuf, A., Coste, P., Laudrel, E., Boutaud, B., Woytasik, M., Lefeuvre, E.

المصدر: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-6 Jun, 2020

Relation: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Bessouet, Clement, Lemettre, Sylvain, Bosseboeuf, Alain, Coste, Philippe, Lecoq, Helene, Sauvage, Thierry, Moulin, Johan

المصدر: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2019 Symposium on. :1-4 May, 2019

Relation: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)