المؤلفون: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-5 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Thanh, T. Nguyen, Blanc, N., Boudet, N., Bourjot, E., Zhiou, S., Kovacova, V., Rodriguez, P., Nemouchi, F., Gergaud, P.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :53-56 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Carter, R., Mazurier, J., Pirro, L., Sachse, J-U., Baars, P., Faul, J., Grass, C., Grasshoff, G., Javorka, P., Kammler, T., Preusse, A., Nielsen, S., Heller, T., Schmidt, J., Niebojewski, H., Chou, P-Y., Smith, E., Erben, E., Metze, C., Bao, C., Andee, Y., Aydin, I., Morvan, S., Bernard, J., Bourjot, E., Feudel, T., Harame, D., Nelluri, R., Thees, H.-J., M-Meskamp, L., Kluth, J., Mulfinger, R., Rashed, M., Taylor, R., Weintraub, C., Hoentschel, J., Vinet, M., Schaeffer, J., Rice, B.

المصدر: 2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :2.2.1-2.2.4 Dec, 2016

Relation: 2016 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Bourjot, E., Putero, M., Perrin-Pellegrino, C., Gergaud, P., Gregoire, M., Nemouchi, F., Mangelinck, D.

المصدر: In Microelectronic Engineering 25 May 2014 120:163-167

المؤلفون: Bourjot, E., Grégoire, M., Nemouchi, F., Mangelinck, D.

المصدر: Journal of Applied Physics; 2017, Vol. 121 Issue 13, p1-15, 15p, 10 Diagrams, 10 Graphs

مصطلحات موضوعية: ELECTRIC admittance measurement, LASER deposition, BRAGG'S X-ray spectrometer, ULTRASONIC imaging, VISCOELASTICITY, ELECTROSPINNING, MAGNETIC dipoles, EXCITON theory

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