المؤلفون: Gardes, P., Roqueta, F., Diatta, M., Martinez, P., Lauron, F., Bouyssou, E., Poveda, P.

المصدر: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. :1-8 Apr, 2016

Relation: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Diatta, M. A., Tremouilles, D., Bouyssou, E., Bafleur, M.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 12(4):607-614 Dec, 2012

المؤلفون: Lin, H., Bouyssou, E., Ventura, L.

المصدر: 2011 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International. :87-89 Oct, 2011

Relation: 2011 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Buvat, Y., Bouyssou, E., Morillon, B., Gautier, G.

المصدر: In Microelectronics Reliability November 2020 114

المؤلفون: Diatta, M., Tremouilles, D., Bouyssou, E., Perdreau, R., Anceau, C., Bafleur, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 59(1):108-113 Jan, 2012

المؤلفون: Fiannaca, G., Gardes, P., Berneux, L., Bouyssou, E., Anceau, C.

المصدر: 2009 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report, 2009. IRW '09. IEEE International. :117-119 Oct, 2009

Relation: 2009 IEEE International Integrated Reliability Workshop (IRW)

المؤلفون: Verchiani, M., Bouyssou, E., Cantin, F., Anceau, C., Ranson, P.

المصدر: 2008 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2008. IRPS 2008. IEEE International. :631-632 Apr, 2008

Relation: 2008 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Bouyssou, E., Guegan, G., Bruyere, S., Pezzani, R., Berneux, L., De Morais, L.D., Rebrasse, J.-P., Anceau, C., Nopper, C.

المصدر: 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual Reliability physics symposium, 2007. proceedings. 45th annual. ieee international. :433-438 Apr, 2007

Relation: 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual

المؤلفون: Gardes, P., Diatta, M., Proust, M., Bouyssou, E., Poveda, P.

المصدر: Journal of Applied Physics; 6/7/2021, Vol. 129 Issue 21, p1-8, 8p

مصطلحات موضوعية: DIELECTRIC materials, CAPACITORS, SOL-gel processes, PERMITTIVITY, BREAKDOWN voltage, RADIOFREQUENCY sputtering

المؤلفون: Bouyssou, E., Bruyere, S., Guegan, G., Anceau, C., Jerisian, R.

المصدر: 2005 IEEE International Integrated Reliability Workshop Integrated Reliability Workshop Integrated Reliability Workshop Final Report, 2005 IEEE International. :4 pp. 2005

Relation: 2005 IEEE International Integrated Reliability Workshop Final Report