المؤلفون: Burr, G. W., Tsai, H., Simon, W., Boybat, I., Ambrogio, S., Ho, C.-E., Liou, Z.-W., Rasch, M., Buchel, J., Narayanan, P., Gordon, T., Jain, S., Levin, T. M., Hosokawa, K., Le Gallo, M., Smith, H., Ishii, M., Kohda, Y., Chen, A., Mackin, C., Fasoli, A., ElMaghraoui, K., Muralidhar, R., Okazaki, A., Chen, C. -T., Frank, M. M., Lammie, C., Vasilopoulos, A., Friz, A. M., Luquin, J., Teehan, S., Ahsan, I., Sebastian, A., Narayanan, V.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Klein, J., Boybat, I., Qureshi, Y.M., Dazzi, M., Levisse, A., Ansaloni, G., Zapater, M., Sebastian, A., Atienza, D.

المصدر: IEEE Transactions on Computers IEEE Trans. Comput. Computers, IEEE Transactions on. 72(7):1985-1998 Jul, 2023

المؤلفون: Jain, S., Tsai, H., Chen, C., Muralidhar, R., Boybat, I., Frank, M.M., Wozniak, S., Stanisavljevic, M., Adusumilli, P., Narayanan, P., Hosokawa, K., Ishii, M., Kumar, A., Narayanan, V., Burr, G.W.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 31(1):114-127 Jan, 2023

المؤلفون: Zhou, C., Redondo, F.G., Buchel, J., Boybat, I., Comas, X.T., Nandakumar, S.R., Das, S., Sebastian, A., Le Gallo, M., Whatmough, P.N.

المصدر: IEEE Micro Micro, IEEE. 42(6):76-87 Jan, 2022

المؤلفون: Garofalo, A., Ottavi, G., Conti, F., Karunaratne, G., Boybat, I., Benini, L., Rossi, D.

المصدر: IEEE Journal on Emerging and Selected Topics in Circuits and Systems IEEE J. Emerg. Sel. Topics Circuits Syst. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on. 12(2):422-435 Jun, 2022

المؤلفون: Bruce, R.L., Sarwat, S. Ghazi, Boybat, I., Cheng, C.-W., Kim, W., Nandakumar, S.R., Mackin, C., Philip, T., Liu, Z., Brew, K., Gong, N., Ok, I., Adusumilli, P., Spoon, K., Ambrogio, S., Kersting, B., Bohnstingl, T., Gallo, M. Le, Simon, A., Li, N., Saraf, I., Han, J.-P., Gignac, L., Papalia, J.M., Yamashita, T., Saulnier, N., Burr, G. W., Tsai, H., Sebastian, A., Narayanan, V., BrightSky, M.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Boybat, I., Nandakumar, S. R., Gallo, M. Le, Rajendran, B., Leblebici, Y., Sebastian, A., Eleftheriou, E.

المصدر: 2018 Non-Volatile Memory Technology Symposium (NVMTS) Non-Volatile Memory Technology Symposium (NVMTS), 2018. :1-4 Oct, 2018

Relation: 2018 Non-Volatile Memory Technology Symposium (NVMTS)

المؤلفون: Boybat, I., Kersting, B., Sarwat, S. Ghazi, Timoneda, X., Bruce, R. L., BrightSky, M., Gallo, M. Le, Sebastian, A.

المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :28.3.1-28.3.4 Dec, 2021

Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Boybat, I., Le Gallo, M., Nandakumar, S.R., Moraitis, T., Tuma, T., Rajendran, B., Leblebici, Y., Sebastian, A., Eleftheriou, E.

المصدر: 2017 17th Non-Volatile Memory Technology Symposium (NVMTS) Non-Volatile Memory Technology Symposium (NVMTS), 2017 17th. :1-4 Aug, 2017

Relation: 2017 17th Non-Volatile Memory Technology Symposium (NVMTS)

المؤلفون: Sebastian, A., Boybat, I., Dazzi, M., Giannopoulos, I., Jonnalagadda, V., Joshi, V., Karunaratne, G., Kersting, B., Khaddam-Aljameh, R., Nandakumar, S. R., Petropoulos, A., Piveteau, C., Antonakopoulos, T., Rajendran, B., Gallo, M. Le, Eleftheriou, E.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T168-T169 Jun, 2019

Relation: 2019 Symposium on VLSI Technology