المؤلفون: Holguin, Eduardo, Procel, Luis Miguel, Brenes, Alexis, Vladimirescu, Andrei, Trojman, Lionel

المصدر: 2023 IEEE 14th Latin America Symposium on Circuits and Systems (LASCAS) Circuits and Systems (LASCAS), 2023 IEEE 14th Latin America Symposium on. :1-4 Feb, 2023

Relation: 2023 IEEE 14th Latin America Symposium on Circuits and Systems (LASCAS)

المؤلفون: Holguin, Eduardo, Trojman, Lionel, Procel, Luis Miguel, Brenes, Alexis, Vladimirescu, Andrei

المصدر: 2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME) Ph.D Research in Microelectronics and Electronics (PRIME), 2022 17th Conference on. :209-212 Jun, 2022

Relation: 2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)

المؤلفون: Juillard, Jerome, Somma, Antonio, Brenes, Alexis

المصدر: 2021 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL) Inertial Sensors and Systems (INERTIAL), 2021 IEEE International Symposium on. :1-4 Mar, 2021

Relation: 2021 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)

المؤلفون: Koteiche, Ali, Brenes, Alexis, Malleron, Kevin, Sou, Gerard

المصدر: 2020 IEEE Wireless Power Transfer Conference (WPTC) Wireless Power Transfer Conference (WPTC), 2020 IEEE. :488-491 Nov, 2020

Relation: 2020 IEEE Wireless Power Transfer Conference (WPTC)

المؤلفون: Juillard, Jerome, Somma, Antonio, Brenes, Alexis

المصدر: 2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF) Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF), 2020 Joint Conference of the IEEE International. :1-4 Jul, 2020

Relation: 2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

المؤلفون: Juillard, Jerome, Brenes, Alexis, Gouspy, Manon, Kraft, Michael

المصدر: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2019 Symposium on. :1-4 May, 2019

Relation: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Brenes, Alexis, Vysotskyi, Bogdan, Lefeuvre, Elie, Juillard, Jerome

المصدر: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2019 Symposium on. :1-4 May, 2019

Relation: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Vysotskyi, Bogdan, Ambia Campos, Jose-Francisco, Lefeuvre, Elie, Brenes, Alexis

المصدر: In Mechanical Systems and Signal Processing 1 January 2024 206

المؤلفون: Balasubramaniyan, Sankari^Aff12, Parmentier, François^Aff13, Roulleau, Preden^Aff13, Thevenin, Mathieu^Aff13, Brenes, Alexis^Aff14, Trocan, Maria^Aff14

المساهمون: Goos, Gerhard, Founding Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, Bertino, Elisa, Editorial Board Member^Aff3, Gao, Wen, Editorial Board Member^Aff4, Steffen, Bernhard, Editorial Board Member^Aff5, Woeginger, Gerhard, Editorial Board Member^Aff6, Yung, Moti, Editorial Board Member^Aff7, Nguyen, Ngoc Thanh, editor^Aff8, Iliadis, Lazaros, editor^Aff9, Maglogiannis, Ilias, editor^Aff10, Trawiński, Bogdan, editor^Aff11

المصدر: Computational Collective Intelligence : 13th International Conference, ICCCI 2021, Rhodes, Greece, September 29 – October 1, 2021, Proceedings. 12876:784-791

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.