المؤلفون: Widodo, T. S., Brun, X. F., Lianto, P., Tan, A., Lie, J., Lim, P., See, G. H.

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Deb, N., Tomita, Y., Brun, X. F., Masuyama, C., Hirano, Y., Hamada, N., Wada, K., Oshida, H., Ganbayashi, K.

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :29-33 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, Z., Li, W., Cetegen, E., Guo, Y., Liu, N., Okafor, I., Mehta, V., Brun, X., Zhong, S., Li, H., Rumer, C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1510-1515 Sep, 2023

المؤلفون: Surapaneni, R., Hamlin, B. S., Chiu, J., Brun, X. F., Barnett, R., Muggeridge, M., Bhasker, H., Richards, N.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1019-1024 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Widodo, T. S., Brun, X. F., Tsunoda, N., Ichige, Y., Arata, S., Noda, C., Nomura, S., Kondo, S.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1271-1276 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Deb, N., Brun, X. F., Masuyama, C., Hamada, N., Hirano, Y., Wada, K., Oshida, H., Ganbayashi, K., Zhou, L. L., Lu, T. Y.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :43-49 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Schuller, L., Gauthier, J., Delpoux, R., Brun, X.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 69(11):10926-10934 Nov, 2022

المؤلفون: Arata, Shogo, Noda, Chiaki, Ichige, Yasuhiro, Nomura, Satoyuki, Widodo, T. S., Tsunoda, N., Brun, X. F.

المصدر: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :87-89 Jun, 2022

Relation: 2022 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Elsherbini, A., Jun, K., Liff, S., Talukdar, T., Bielefeld, J., Li, W., Vreeland, R., Niazi, H., Rawlings, B., Ajayi, T., Tsunoda, N., Hoff, T., Woods, C., Pasdast, G., Tiagaraj, S., Kabir, E., Shi, Y., Brezinski, W., Jordan, R., Ng, J., Brun, X., Krisnatreya, B., Liu, P., Zhang, B., Qian, Z., Goel, M., Swan, J., Yin, G., Pelto, C., Torres, J., Fischer, P.

المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.3.1-27.3.4 Dec, 2022

Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Humbert, G., Pham, M.T., Brun, X., Guillemot, M., Noterman, D.

المصدر: 2015 IEEE 20th Conference on Emerging Technologies & Factory Automation (ETFA) Emerging Technologies & Factory Automation (ETFA), 2015 IEEE 20th Conference on. :1-8 Sep, 2015

Relation: 2015 IEEE 20th Conference on Emerging Technologies & Factory Automation (ETFA)