المؤلفون: Gielen, A.W.J., Hesen, P., Swartjes, F., van Zeijl, H., Boschman, F., Bullema, J-E., Werkhoven, R.J., Koh, S.

المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-7 Sep, 2011

Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Bullema, J. E., Werkhoven, R. J., Gielen, A. W. J., Kunen, J. M. G., Hesen, P., Swartjes, F., Boschman, F.

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-3 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Bullema, J. E., Bressers, P. M. M. C., Oosterhuis, G., Mueller, M., Huis In T Veld, A. J., Fred Roozeboom

المساهمون: Plasma & Materials Processing

المصدر: EMPC-2011-18th European Microelectronics and Packaging Conference, Proceedings
Scopus-Elsevier
18th European Microelectronics and Packaging Conference, EMPC-2011, 12-15 September 2011, Brighton, Uk

مصطلحات موضوعية: Functional integration, High costs, Through-Silicon-Via, TS - Technical Sciences, Through silicon vias, Industrial Innovation, Laser drilling, Packaging technologies, laser induced forward transfer, Electrochemical Machining, Creation process, Mechatronics, Mechanics & Materials, Hardware_PERFORMANCEANDRELIABILITY, Through Silicon Via, electrochemical machining, Laser Induced Forward Transfer, EAM - Equipment for Additive Manufacturing TFT - Thin Film Technology, Processing time, Cost of ownership, Deep Reactive Ion etching, Pulse reverse plating, Hardware_INTEGRATEDCIRCUITS, Electronics, 3D stacking, deep reactive ion etching

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::987f25b47c1823ae5cd1502ebcdeeb71
https://research.tue.nl/nl/publications/ef80f618-ced0-4761-8ec2-f25c3ffdabdd

المؤلفون: Röser, T., Klaus Stefan Drese, Fütterer, X., Germar, F. V., Hansen-Hagge, T. E., Ritzi, M., Bullema, J. -E, Bolt, P. J.

المصدر: Scopus-Elsevier
NSTI Nanotechnology Conference and Trade Show, NSTI Nanotech 2007, 20-24 May 2007, Santa Clara, CA, USA, 2, 235-238

مصطلحات موضوعية: DNA/RNA extraction, Cell lysis, Lab-on-a-Chip, Industrial Innovation, Electric field effects, Nanotechnology, Extraction, DNA, Biomedical engineering, Purification

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::6d651c0851a8619b99a1d8ae5c2d3d66
http://resolver.tudelft.nl/uuid:bf8b2027-c404-49f9-b2df-5f0e661beae5

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