المؤلفون: C Brown, C Key, K Duchin, F Montealegr-Golcher, EA Lisbon

المصدر: Hematology, Transfusion and Cell Therapy, Vol 45, Iss , Pp S59-S60 (2023)

مصطلحات موضوعية: Diseases of the blood and blood-forming organs, RC633-647.5

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2531137923003620; https://doaj.org/toc/2531-1379

URL الوصول: https://doaj.org/article/3605c2ab90b44b13a63e2f664d382b90

المؤلفون: Xiang, Min, Ma, Li, Li, Honglei, Jiang, Wei, Chung, C. Key

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Chung, C. Key, Liu, Luke, Cai, Wuhong, Zhuang, Jiaming, Li, Shangxuan, Shi, Peipei

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: You, JinWei, Li, Jay, Ho, David, Li, Jackson, Zhuang, Ming Han, Lai, David, Chung, C. Key, Wang, Yu-Po

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2030-2034 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Chan, Mu Hsuan, Chuang, Chris, Huang, Yu Lung, Chen, Wei Jhen, Jiang, Don Son, Huang, C.M., Chung, C. Key

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :481-486 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Huang, Yu Lung, Chung, C. Key, Lin, C.F., Yu, Kuo Haw, Lin, Rung Jeng, Hong, Wilson

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1102-1108 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Refai-Ahmed, Gamal, Wang, Huayan, Ramalingam, Suresh, Karunakaran, Nagadeven, Pan, Ke, Park, SB, Soundarajan, Alegesen, Kanaran, Sreedharan Kelappen, Chung, C. Key, Huang, Yu Lung

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :104-111 Dec, 2020

Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Chang, Nistec, Chung, C. Key, Wang, Yu-Po, Lin, C. F., Su, PJ, Shih, Teny, Kao, Nicholas, Hung, Joe

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1888-1893 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, Joe, Chung, C. Key, Lin, C. F., Liao, Ally, Lu, Ying Ju, Shuang Chen, Jia, Ng, Daniel

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :14-18 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Huang, Yu Lung, Chung, C. Key, Lin, C.F., Xu, Bruce, Liao, Yunn Shiuan

المصدر: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :146-149 Oct, 2019

Relation: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)