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1دورية أكاديمية
المؤلفون: Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa
المصدر: Scientific Reports, Vol 13, Iss 1, Pp 1-10 (2023)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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2دورية أكاديمية
المؤلفون: Chih-Chia Bill Chang, C. R. Kao
المصدر: Materials, Vol 17, Iss 4, p 883 (2024)
مصطلحات موضوعية: phase diagram, phase equilibria, intermetallics, EPMA, XRD, NiGa5, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa
المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-12 (2022)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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4دورية أكاديمية
المؤلفون: Han-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai, Chia-Yi Liao, C. R. Kao
المصدر: Materials, Vol 16, Iss 18, p 6263 (2023)
مصطلحات موضوعية: low melting-point solder, interfacial reaction, In, CuIn2, intermetallic compounds, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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5دورية أكاديمية
المؤلفون: Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, Chen-Wei Kao, C. R. Kao
المصدر: Materials, Vol 16, Iss 9, p 3290 (2023)
مصطلحات موضوعية: low-temperature soldering, interconnection, Cu-In-Sn intermetallic compounds, interfacial reaction, mechanical properties, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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6دورية أكاديمية
المؤلفون: Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, C. R. Kao
المصدر: Materials, Vol 15, Iss 21, p 7783 (2022)
مصطلحات موضوعية: 3D integration, Cu-to-Cu bonding, low pressure, compensate height difference, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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7دورية أكاديمية
المؤلفون: Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, C. R. Kao
المصدر: Materials, Vol 15, Iss 12, p 4297 (2022)
مصطلحات موضوعية: micro-joints, solid-state reaction, intermetallic, adhesion layer, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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8
المؤلفون: Y. C. Lin, C. H. Shen, C. Y. Hung, P. S. Shih, J. H. Huang, C. L. Kao, Y. S. Lin, Y. C. Hung, C. R. Kao
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4cd8a539e91ab6b9b057412a3c081d2e
https://doi.org/10.23919/icep58572.2023.10129649 -
9
المؤلفون: F. L. Chang, Y. H. Lin, C. R. Kao
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::18b84ae8f8f371ecaa529f8029632606
https://doi.org/10.23919/icep58572.2023.10129721 -
10
المؤلفون: P. Y. Kung, W. L. Huang, C. L. Kao, Y. C. Hung, C. R. Kao
المصدر: 2023 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a21e2d6ee0ce951cea1a73c7f7988b84
https://doi.org/10.23919/icep58572.2023.10129779