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المؤلفون: V. Loup, G. Audoit, S. Reboh, R. Coquand, M. Vinet, M. Barlas, N. Rambal, S Barraud, A. Toffoli, E. Vianello, C. Jahan, V. Beugin, Vincent Delaye, O. Pollet, L. Brevard, C. Vizioz, O. Faynot, T. Dewolf, Nicolas Posseme, S. Chevalliez, N. Allouti, L. Perniola, Sébastien Barnola, B. Bouix, S. Bernasconi, C. Comboroure, Philippe Rodriguez, Yves Morand, C. Tallaron, L. Grenouillet
المصدر: Extended Abstracts of the 2017 International Conference on Solid State Devices and Materials.
مصطلحات موضوعية: Materials science, law, Process (engineering), Transistor, Engineering physics, law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::40e32b0961ff0b1c447494a433e2c935
https://doi.org/10.7567/ssdm.2017.d-1-04 -
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المؤلفون: Lamia Nouri, Marie-Line Pourteau, Nicolas Posseme, M. May, C. Tallaron, Isabelle Servin, Jonathan Pradelles, Ahmed Gharbi, Bernard Dalzotto, Sébastien Barnola, F. Delachat, Stefan Landis, C. Lapeyre, Aurelien Sarrazin, Philippe Essomba, M. Argoud, P. Brianceau, H. Teyssedre, A. Bernadac, P. Pimenta Barros, R. Tiron, G. Chamiot-Maitral, Yoann Blancquaert, Laurent Pain, Guillaume Claveau, Sandra Bos
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Computer science, Computational lithography, Extreme ultraviolet lithography, Nanotechnology, Hardware_PERFORMANCEANDRELIABILITY, Nanoimprint lithography, law.invention, law, Hardware_INTEGRATEDCIRCUITS, Systems engineering, Multiple patterning, Multi beam, Lithography, Immersion lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c2df2d94c4d940e340bc2ac65e3698ee
https://doi.org/10.1117/12.2259966 -
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المؤلفون: X. Garros, N. Rambal, C. Fenouillet-Beranger, M. Brocard, L. Pasini, G. Cibrario, Thomas Skotnicki, M.-P. Samson, A. Ayres, Laurent Brunet, M. Vinet, C. Tallaron, C-M. V., O. Billoint, R. Gassilloud, Francois Andrieu, R. Kies, G. Romano, Perrine Batude, Bernard Previtali, A. Toffoli, M. Casse, P. Besombes, C. Leroux, Claude Tabone, V. Lapras, A. Laurent, D. Barge
المصدر: 2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).
مصطلحات موضوعية: Footprint (electronics), Reduction (complexity), Materials science, Reliability (semiconductor), CMOS, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Stacking, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, Static random-access memory, NMOS logic
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8f5a2b330e51e3a5752e754ac6b9e197
https://doi.org/10.1109/vlsi-tsa.2017.7942495 -
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المؤلفون: G. Molas, R. Kies, A. De Luca, C. Tallaron, B. De Salvo, Christelle Charpin-Nicolle, O. Cueto, G. Médico, A. Persico, F. Aussenac, L. Masoero
المصدر: Microelectronic Engineering. 118:15-19
مصطلحات موضوعية: Dynamic random-access memory, Hardware_MEMORYSTRUCTURES, Materials science, Sense amplifier, business.industry, Semiconductor memory, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Non-volatile memory, law, Hardware_INTEGRATEDCIRCUITS, Bubble memory, Optoelectronics, Non-volatile random-access memory, Electrical and Electronic Engineering, business, Gate equivalent, Computer memory, Hardware_LOGICDESIGN
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المؤلفون: L. Vignoud, Christian Olagnon, Rafael Estevez, Jérôme Chevalier, C. Tallaron, M. Romero de la Osa
المصدر: International Journal of Fracture. 158:157-167
مصطلحات موضوعية: Materials science, business.industry, Computational Mechanics, Fracture mechanics, Structural engineering, Microstructure, Cohesive zone model, Flexural strength, Mechanics of Materials, Modeling and Simulation, visual_art, Fracture (geology), visual_art.visual_art_medium, Ceramic, Composite material, business, Single crystal, Plane stress
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المؤلفون: Sébastien Barnola, Raluca Tiron, P. Pimenta Barros, Christophe Navarro, C. Lapeyre, Aurelien Sarrazin, Xavier Chevalier, Guillaume Claveau, Nicolas Posseme, Sandra Bos, C. Tallaron, Celia Nicolet, Ahmed Gharbi, C. Monget, M. Argoud, Isabelle Servin
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Computer science, Etching (microfabrication), Chemical-mechanical planarization, Etching, Process (computing), Copolymer, Electronic engineering, Nanotechnology, Critical dimension
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aa4c223603969fe1bb291f96f296940f
https://doi.org/10.1117/12.2086810 -
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المؤلفون: E. Bruneton, N. Gras-Naulin, A. Cosculluela, C. Tallaron
المصدر: Carbon. 40:1919-1927
مصطلحات موضوعية: Materials science, Syntactic foam, Carbon nanofoam, Composite number, chemistry.chemical_element, General Chemistry, Microstructure, Compressive strength, chemistry, General Materials Science, Texture (crystalline), Deformation (engineering), Composite material, Carbon
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المؤلفون: D. Rouby, C. Tallaron, Gilbert Fantozzi, Pascal Reynaud
المصدر: Key Engineering Materials. :329-332
مصطلحات موضوعية: Cyclic stress, Materials science, Mechanics of Materials, Mechanical Engineering, Ultimate tensile strength, Composite number, Reinforced carbon–carbon, General Materials Science, Composite material
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f630560ea09ec37897446e23c7574cf5
https://doi.org/10.4028/www.scientific.net/kem.164-165.329 -
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المؤلفون: C. Tallaron, Pascal Reynaud, F. Conchin, Gilbert Fantozzi, P. Brenet, D. Rouby
المصدر: Composites Science and Technology. 56:817-823
مصطلحات موضوعية: Bridging (networking), Materials science, Composite number, General Engineering, Curve analysis, Fracture mechanics, Instability, Toughening, visual_art, Bundle, Ceramics and Composites, visual_art.visual_art_medium, Ceramic, Composite material
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المساهمون: Matériaux, ingénierie et science [Villeurbanne] (MATEIS), Centre National de la Recherche Scientifique (CNRS)-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA), Science et Ingénierie des Matériaux et Procédés (SIMaP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), CEA Le Ripault (CEA Le Ripault), Direction des Applications Militaires (DAM), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)
المصدر: Modelling and Simulation in Materials Science and Engineering
Modelling and Simulation in Materials Science and Engineering, IOP Publishing, 2011, 19 (7), pp.074009. ⟨10.1088/0965-0393/19/7/074009⟩
Modelling and Simulation in Materials Science and Engineering, 2011, 19 (7), pp.074009. ⟨10.1088/0965-0393/19/7/074009⟩مصطلحات موضوعية: Materials science, Fracture mechanics, 02 engineering and technology, [CHIM.MATE]Chemical Sciences/Material chemistry, Intergranular corrosion, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Microstructure, Grain size, Computer Science Applications, Stress (mechanics), Cohesive zone model, Crack closure, 020303 mechanical engineering & transports, 0203 mechanical engineering, 13. Climate action, Mechanics of Materials, Modeling and Simulation, Fracture (geology), Forensic engineering, General Materials Science, Composite material, 0210 nano-technology
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