المؤلفون: Beigh, Faizan Tariq, Beigh, Nadeem Tariq, Mallick, Dhiman

المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Liu, M., Xu, N., Shen, Y., Xu, C., Farrell, G., Wang, S., Wang, P.

المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 36(11):749-752 Jun, 2024

المؤلفون: Murzin, S.P.

المصدر: 2024 X International Conference on Information Technology and Nanotechnology (ITNT) Information Technology and Nanotechnology (ITNT), 2024 X International Conference on. :1-6 May, 2024

Relation: 2024 X International Conference on Information Technology and Nanotechnology (ITNT)

المؤلفون: Moorthi, K, Danush, N, Amarthiyasen, R, Mukilan, B

المصدر: 2024 International Conference on Communication, Computing and Internet of Things (IC3IoT) Communication, Computing and Internet of Things (IC3IoT), 2024 International Conference on. :1-5 Apr, 2024

Relation: 2024 International Conference on Communication, Computing and Internet of Things (IC3IoT)

المؤلفون: Peng, Chongnan, Tao, Qi, Krivec, Thomas, Casas, Guillermo, Latorre, Salvador, Antretter, Thomas, Macher, Johannes, Fuchs, Peter

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Zhao, J., Zhang, H., Fu, Y., Qin, L., Shi, J., Zhao, Y., Wang, Z.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(10):16130-16136 May, 2024

المؤلفون: Liu, J., Mao, S., Xu, J., Chen, Z., Bai, G., He, X., Xiong, W., He, Y., Yu, J., Li, J., Sun, X., Wang, G., Zhao, C., Luo, J.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):1957-1962 Mar, 2024

المؤلفون: Dicorato, S., Giangregorio, M.M., Losurdo, M.

المصدر: 2023 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2023 International. :129-132 Oct, 2023

Relation: 2023 International Semiconductor Conference (CAS)

المؤلفون: Chen, M. H., Cheng, C. I, Lin, Y. C., Kao, J. C.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :25-26 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Wang, Meng, Yang, Xue, Ni, Na, Ye, Jing, Yang, Zhen, Tian, Yanling

المصدر: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2023 IEEE International Conference on. :167-170 Jul, 2023

Relation: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)