المؤلفون: Provan, G., Margaria, T.

المصدر: IT Professional IT Prof. IT Professional. 26(1):50-56 Jan, 2024

المؤلفون: Prudencio, Antonio Vazquez^Aff2, Þórðardóttir, Unnur Lilja^Aff2, Meng, Lu^Aff2, Shaikh, Robiul Haque^Aff2, Chen, Qing^{Aff2, Aff3}

المساهمون: The Minerals, Metals & Materials Society

المصدر: TMS 2024 153rd Annual Meeting & Exhibition Supplemental Proceedings. :1389-1399

المؤلفون: Tyner, Alexander

المصدر: Journal of Physics. 36(32)

مصطلحات موضوعية: topology, disorder, computational materials science, band theory

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:su:diva-231218
https://doi.org/10.1088/1361-648X/ad475f

المؤلفون: Zhong, Li, Hoppe, Dennis, Zhou, Naweiluo, Shcherbakov, Oleksandr

المصدر: 2021 IEEE International Conference on Cluster Computing (CLUSTER) CLUSTER Cluster Computing (CLUSTER), 2021 IEEE International Conference on. :698-704 Sep, 2021

Relation: 2021 IEEE International Conference on Cluster Computing (CLUSTER)

المؤلفون: Haonan Chen, Sagar Saren, Xuetao Liu, Ji Hwan Jeong, Takahiko Miyazaki, Young-Deuk Kim, Kyaw Thu

المصدر: iScience, Vol 27, Iss 8, Pp 110449- (2024)

مصطلحات موضوعية: Engineering, Materials science, Computational materials science, Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2589004224016742; https://doaj.org/toc/2589-0042

URL الوصول: https://doaj.org/article/cbaf21a7c9f9463b90d09122441933ed

المؤلفون: Kadomoto, J., Sasatani, T., Narumi, K., Usami, N., Irie, H., Sakai, S., Kawahara, Y.

المصدر: IEEE Pervasive Computing IEEE Pervasive Comput. Pervasive Computing, IEEE. 20(3):9-17 Sep, 2021

المؤلفون: Wicaksono, I., Cherston, J., Paradiso, J.A.

المصدر: IEEE Pervasive Computing IEEE Pervasive Comput. Pervasive Computing, IEEE. 20(3):18-29 Sep, 2021

المؤلفون: Qiaolin Gou, Jing Liu, Haoming Su, Yanzhi Guo, Jiayi Chen, Xueyan Zhao, Xuemei Pu

المصدر: iScience, Vol 27, Iss 4, Pp 109452- (2024)

مصطلحات موضوعية: Artificial intelligence, Machine learning, Computational materials science, Energy materials, Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2589004224006734; https://doaj.org/toc/2589-0042

URL الوصول: https://doaj.org/article/ae746fc2486d4588b6b288974bb10c66

المؤلفون: Varakantham, Sujith Reddy, Kliem, Herbert

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 28(1):58-65 Feb, 2021

المؤلفون: Vogel, Thomas, Druskat, Stephan, Scheidgen, Markus, Draxl, Claudia, Grunske, Lars

المصدر: 2019 IEEE/ACM 14th International Workshop on Software Engineering for Science (SE4Science) Software Engineering for Science (SE4Science), 2019 IEEE/ACM 14th International Workshop on. :25-32 May, 2019

Relation: 2019 IEEE/ACM 14th International Workshop on Software Engineering for Science (SE4Science)