يعرض 1 - 10 نتائج من 68,750 نتيجة بحث عن '"CONTACTS"', وقت الاستعلام: 1.53s تنقيح النتائج
  1. 1
    مؤتمر
    Condition Assessment of Low-Voltage Electrical Equipment Based on Thermal Imaging Control

    المؤلفون: Valtchev, Stanimir, Petrov, Almaz, Gracheva, Elena, Sinyukova, Tatyana, Miceli, Rosario, Goncalves, Jose

    المصدر: 2024 6th Global Power, Energy and Communication Conference (GPECOM) Power, Energy and Communication Conference (GPECOM), 2024 6th Global. :472-476 Jun, 2024

    Relation: 2024 6th Global Power, Energy and Communication Conference (GPECOM)

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  2. 2
    مؤتمر
    Accurate Estimation of Individual Transmission Rates Through Contact Analytics Using UWB Based Indoor Location Data

    المؤلفون: Thota, Ravi Chandra, Sara, Sarawat Murtaza, Sarwar Uddin, Md Yusuf, Bani-Yaghoub, Majid, Sutkin, Gary

    المصدر: 2024 International Conference on Smart Applications, Communications and Networking (SmartNets) Smart Applications, Communications and Networking (SmartNets), 2024 International Conference on. :1-8 May, 2024

    Relation: 2024 International Conference on Smart Applications, Communications and Networking (SmartNets)

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  3. 3
    دورية أكاديمية
    Toward a Metal-Free Contact Based on Multilayer Epitaxial Graphene on 4H-SiC

    المؤلفون: Crupi, I., Bellocchi, G., Vabres, R., Bongiorno, C., Badala, P., Macaluso, R., Mosca, M., Rascuna, S.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1109-1112 Jul, 2024

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  4. 4
    مؤتمر
    Implementation of SCADA for IEC 61850 communication in the IEEE 14-Bus System

    المؤلفون: Jacome-Barrionuevo, Antony, Quizhpi-Cuesta, Mateo, Quizhpi-Palomeque, Flavio

    المصدر: 2024 6th Global Power, Energy and Communication Conference (GPECOM) Power, Energy and Communication Conference (GPECOM), 2024 6th Global. :577-583 Jun, 2024

    Relation: 2024 6th Global Power, Energy and Communication Conference (GPECOM)

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  5. 5
    مؤتمر
    Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective Metal Passivation (Interface Metal) Technology for 3D IC and Advanced Packaging

    المؤلفون: Hsu, Mu-Ping, Tsai, Wen-Tsu, Lee, Ou-Hsiang, Chen, Chi-Yu, Kuo, Tzu-Ying, Chang, Hsiang-Hung, Chang, Hsin-Chi, Hong, Zhong-Jie, Chen, Kuan-Neng

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2131-2135 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding

    المؤلفون: De Messemaeker, Joke, Van Sever, Koen, Tsau, Yan Wen, Zhang, Boyao, Croes, Kristof, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1853-1858 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Diamond Like Carbon Film Deposited via RF Plasma Enhanced Chemical Vapor Deposition for Insulating and Hydrophobic Properties in Advanced Nano-Electronics Applications

    المؤلفون: Shabbir, Altamash, Khan, Zuhair S.

    المصدر: 2024 International Conference on Engineering & Computing Technologies (ICECT) Engineering & Computing Technologies (ICECT), 2024 International Conference on. :1-6 May, 2024

    Relation: 2024 International Conference on Engineering & Computing Technologies (ICECT)

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  8. 8
    مؤتمر
    Optimization of the Metal Deposition Process for the Accurate Estimation of Low Metal-Graphene Contact-Resistance

    المؤلفون: Capista, Daniele, Lukose, Rasuole, Majnoon, Farnaz, Lisker, Marco, Wenger, Christian, Lukosius, Mindaugas

    المصدر: 2024 47th MIPRO ICT and Electronics Convention (MIPRO) MIPRO ICT and Electronics Convention (MIPRO), 2024 47th. :1561-1565 May, 2024

    Relation: 2024 47th MIPRO ICT and Electronics Convention (MIPRO)

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  9. 9
    مؤتمر
    Method for Quality Control of Electronic Equipment Units Assembly Based on the Analysis of the Contact Radio Interference Level

    المؤلفون: Utkin, Boris, Grachev, Nikolay, Utkin, Mikhail

    المصدر: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) Industrial Engineering, Applications and Manufacturing (ICIEAM), 2024 International Conference on. :386-391 May, 2024

    Relation: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)

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  10. 10
    مؤتمر
    Mathematical Model to Define Electric Capacity of Transient Region of Electrical Contacts

    المؤلفون: Lyuminarskaya, E. S., Lyuminarsky, S. E., Lyuminarsky, I. E.

    المصدر: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) Industrial Engineering, Applications and Manufacturing (ICIEAM), 2024 International Conference on. :403-407 May, 2024

    Relation: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)

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