يعرض 1 - 10 نتائج من 351,407 نتيجة بحث عن '"COOLING"', وقت الاستعلام: 1.77s تنقيح النتائج
  1. 1
    مؤتمر
    Further developments in pandapower and pandapipes

    المؤلفون: Bolgaryn, Roman, Prade, Erik, Banerjee, Gourab, Drauz-Mauel, Simon, Lohmeier, Daniel, Lytaev, Pawel, Marten, Frank, Meinecke, Steffen, Vogt, Mike, Xiang, Yu, Zavistanavicius, Laurynas

    المصدر: 2024 Open Source Modelling and Simulation of Energy Systems (OSMSES) Open Source Modelling and Simulation of Energy Systems (OSMSES), 2024. :1-8 Sep, 2024

    Relation: 2024 Open Source Modelling and Simulation of Energy Systems (OSMSES)

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  2. 2
    مؤتمر
    Electro-Thermo-Mechanical Simulation Analysis Of Multichip SiC MOSFET Power Modules

    المؤلفون: Fan, Yi, Qian, Haoquan, Liu, Hongwei, Wang, Yongzhi, Zhu, Wenhui, Wang, Liancheng

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-06 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    Liquid-Cooled Heat Dissipation Technology for Co-Packaged Optics over 12.8 Tbps

    المؤلفون: Wu, Senhan, Wen, Song, Xue, Haiyun

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    A Miniaturized Integrated System for Embedded Microchannel Cooling with Manifolds

    المؤلفون: Lyu, Peijue, Cao, Huiquan, Hu, Ran, Jin, Yufeng, Zhang, Chi, Wang, Wei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Design of a High-power Density Power Module with Large-area (10 mm × 10 mm) SiC MOSFETs for Traction Inverter Application

    المؤلفون: Jiang, Yi, Che, Liming, Lei, Guangyin

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-06 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Research on Liquid Cooling Test Technology of Ceramic Substrate Packaging Embedded Microchannel

    المؤلفون: Peng, Bo, Wang, Mingyang, Wei, Yujin, Liu, Linjie, Du, Pingan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Research on the Application of Active Thermoelectric Cooling Technology in the Field of Power Chip Heat Dissipation

    المؤلفون: Liu, Tong-Jian, Yu, Zhi, Yan, Xin, Tai, Kai-Ping, Sun, Dong-Ming

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Design and Characteristics of Thermoelectric and Liquid Cooling Composite Active Heat Dissipation of Power Electronics

    المؤلفون: Tian, Ben, Wang, Xinyuan, Chen, Deyi, Xu, Jianming, Guan, Quanxue, Mou, Yun

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Optimization of the Adhesion and Thermal Conductivity of Thermal Interface Materials for Chip Immersion Cooling via Grafting Polar Groups

    المؤلفون: Xie, Xiangchao, Fan, Jianfeng, Rao, Shipeng, Zeng, Xiaoliang, Sun, Rong

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Assessing the Thermal Performance of Combined Radiant Cooling Ceiling and Fan Coil Unit in a Tropical Classroom

    المؤلفون: Bach, Lea, Luis, Hugo, Aziz, Mohammad Miqdad Abdul, Ghasemi, Mohammad Hadi, Kadir, Kushsairy

    المصدر: 2024 IEEE 10th International Conference on Smart Instrumentation, Measurement and Applications (ICSIMA) Smart Instrumentation, Measurement and Applications (ICSIMA), 2024 IEEE 10th International Conference on. :229-233 Jul, 2024

    Relation: 2024 IEEE 10th International Conference on Smart Instrumentation, Measurement and Applications (ICSIMA)

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