المؤلفون: Refai-Ahmed, G., Kabbani, H., Alissa, H., Sammakia, B., Cader, T., Gektin, V., Ramalingam, S., Torza, Anthony

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :909-913 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Refai-Ahmed, Gamal, Islam, Md Malekkul, Kabbani, H., Cader, T., Alissa, Husam, Do, Hoa

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :890-897 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Cader, T., Tolman, B., Kabrell, C., Olsen, D.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :181-187 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Cader, T., Tilton, D.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:699-701 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Cader, T., Westra, L.J., Eden, R.C.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 4(4):605-613 Dec, 2004

المؤلفون: Sahraoui, M., Cader, T., Ahmed, G.R.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:692-693 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Li, B.Q., Cader, T., Schwarzkopf, J., Okamoto, K., Ramaprian, B.

المصدر: In Applied Thermal Engineering 2006 26(16):1788-1795

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