المؤلفون: Biquard, M., Rouxel, A., Lacroix, S., Carfantan, H., Monmayrant, A., Camon, H.

المصدر: 2022 12th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing (WHISPERS) Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing (WHISPERS), 2022 12th Workshop on. :1-5 Sep, 2022

Relation: 2022 12th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing (WHISPERS)

المؤلفون: Calvez, S., Lafleur, G., Stepanenko, O., Arnoult, A., Monmayrant, A., Camon, H., Almuneau, G.

المصدر: 2019 21st International Conference on Transparent Optical Networks (ICTON) Transparent Optical Networks (ICTON), 2019 21st International Conference on. :1-4 Jul, 2019

Relation: 2019 21st International Conference on Transparent Optical Networks (ICTON)

المؤلفون: Heliot, A., Pelloquin, S., Gauthier-Lafaye, O., Monmayrant, A., Camon, H., Gacoin, T., Lahlil, K., Martinelli, L., Biver, C., Archambeau, S.

المصدر: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-5 May, 2018

Relation: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Pelloquin, S., Auge, S., Sharshavina, K., Doucet, J.-B., Heliot, A., Camon, H., Gauthier-Lafaye, O.

المصدر: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017 Symposium on. :1-6 May, 2017

Relation: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Pelloquin, S.^{Aff1, IDs0054201837406_cor1}, Augé, S., Sharshavina, K., Doucet, J.-B., Héliot, A., Camon, H., Monmayrant, A., Gauthier-Lafaye, O.

المصدر: Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. 28(6):1293-1300

المؤلفون: Héliot, A.^{Aff1, Aff2, Aff3, IDs0054202005008z_cor1}, Pelloquin, S., Gauthier-Lafaye, O., Monmayrant, A., Camon, H., Gacoin, T., Lahlil, K., Martinelli, L., Biver, C., Archambeau, S.

المصدر: Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. 28(6):1535-1543

المؤلفون: Blard, F., Bounouh, A., Belieres, D., Camon, H.

المصدر: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. :656-659 Jan, 2011

Relation: 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Endemano, A., Fourniols, J.Y., Camon, H., Marchese, A., Muratet, S., Bony, F., Desmulliez, M.P.Y.

المصدر: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Design, test, integration and packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on. :56-63 2003

Relation: Design, Test, Integration and Packaging of MEMS/MOEMS 2003

المؤلفون: Cichalewski, W., Napieralski, A., Camon, H., Estibals, B.

المصدر: The Experience of Designing and Application of CAD Systems in Microelectronics, 2003. CADSM 2003. Proceedings of the 7th International Conference. CAD systems in microelectronics CAD Systems in Microelectronics, 2003. CADSM 2003. Proceedings of the 7th International Conference. The Experience of Designing and Application of. :360-365 2003

Relation: International Conference on the Experience of Designing and Application of CAD Systems in Microelectronics

المؤلفون: Bounouh, A., Camon, H., Belieres, D.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 62(6):1646-1651 Jun, 2013