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1مؤتمر
المؤلفون: Guarino, L., Caglio, C., Carasi, B., Alesi, M., Villa, R., Cecchetto, L.
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2مؤتمر
المؤلفون: Guarino, L., Caglio, C., Villa, R., Carasi, B., Passagrilli, C., Cecchetto, L.
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :687-693 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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3مؤتمر
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