المؤلفون: Cea, S., Berrada, S., Ghosh, K., Hasan, S., Keys, P., Mehandru, R., Obradovic, B., Tiwari, V., Weber, C., Stettler, M.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :1-4 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Stettler, M., Cea, S., Hasan, S., Jiang, L., Kaushik, A., Keys, P., Kotlyar, R., Landon, C., Pantuso, D., Slepko, A., Smith, S., Tiwari, V., Weber, C., Weber, J. R.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :39.1.1-39.1.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Sarangapani, P., Weber, C., Chang, J., Cea, S., Povolotskyi, M., Klimeck, G., Kubis, T.

المصدر: IEEE Transactions on Nanotechnology IEEE Trans. Nanotechnology Nanotechnology, IEEE Transactions on. 17(5):968-973 Sep, 2018

المؤلفون: Wang, E., Matagne, P., Shifren, L., Obradovic, B., Kotlyar, R., Cea, S., He, J., Ma, Z., Nagisetty, R., Tyagi, S., Stettler, M., Giles, M.D.

المصدر: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :147-150 2004

Relation: 2004 International Electron Devices Meeting

المؤلفون: Kuhn, K., Agostinelli, M., Ahmed, S., Chambers, S., Cea, S., Christensen, S., Fischer, P., Gong, J., Kardas, C., Letson, T., Henning, L., Murthy, A., Muthali, H., Obradovic, B., Packan, P., Pae, S.W., Post, I., Putna, S., Raol, K., Roskowski, A., Soman, R., Thomas, T., Vandervoorn, P., Weiss, M., Young, I.

المصدر: Digest. International Electron Devices Meeting, Electron devices meeting Electron Devices Meeting, 2002. IEDM '02. International. :73-76 2002

Relation: IEEE International Electron Devices Meeting

المؤلفون: Thompson, S., Anand, N., Armstrong, M., Auth, C., Arcot, B., Alavi, M., Bai, P., Bielefeld, J., Bigwood, R., Brandenburg, J., Buehler, M., Cea, S., Chikarmane, V., Choi, C., Frankovic, R., Ghani, T., Glass, G., Han, W., Hoffmann, T., Hussein, M., Jacob, P., Jain, A., Jan, C., Joshi, S., Kenyon, C., Klaus, J., Klopcic, S., Luce, J., Ma, Z., Mcintyre, B., Mistry, K., Murthy, A., Nguyen, P., Pearson, H., Sandford, T., Schweinfurth, R., Shaheed, R., Sivakumar, S., Taylor, M., Tufts, B., Wallace, C., Wang, P., Weber, C., Bohr, M.

المصدر: Digest. International Electron Devices Meeting, Electron devices meeting Electron Devices Meeting, 2002. IEDM '02. International. :61-64 2002

Relation: IEEE International Electron Devices Meeting

المؤلفون: Wang, E.X., Matagne, P., Shifren, L., Obradovic, B., Kotlyar, R., Cea, S., Stettler, M., Giles, M.D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 53(8):1840-1851 Aug, 2006

المؤلفون: Kotlyar, R., Degtyarov, V., Slepko, A., Kaushik, A. P., Weber, J. R., Cea, S. M.

المصدر: 2016 74th Annual Device Research Conference (DRC) Device Research Conference (DRC), 2016 74th Annual. :1-1 Jun, 2016

Relation: 2016 74th Annual Device Research Conference (DRC)

المؤلفون: Thompson, S.E., Armstrong, M., Auth, C., Alavi, M., Buehler, M., Chau, R., Cea, S., Ghani, T., Glass, G., Hoffman, T., Jan, C.-H., Kenyon, C., Klaus, J., Kuhn, K., Zhiyong Ma, Mcintyre, B., Mistry, K., Murthy, A., Obradovic, B., Nagisetty, R., Phi Nguyen, Sivakumar, S., Shaheed, R., Shifren, L., Tufts, B., Tyagi, S., Bohr, M., El-Mansy, Y.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(11):1790-1797 Nov, 2004

المؤلفون: Cea, S., Law, M.E.

المصدر: Proceedings of International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V Numerical modeling of processes and devices for integrated circuits Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on. :113-116 1994

Relation: Proceedings of International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V