المؤلفون: Jeung-Woo Kim, Won-Sang Song, Sam-Young Kim, Hyan-Soo Kim, Hyun-Goo Jeon, Chae-Bog Lim

المصدر: Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the. :174-177 2001

Relation: Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001

المؤلفون: Won-sang Song, Hyun-Goo Jeon, Sam-Young Kim, Chae-Bog Lim, Jeung-Woo Kim, Hyan-Soo Kim

المصدر: Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).

مصطلحات موضوعية: Stress (mechanics), Materials science, Electrical resistivity and conductivity, Electronic engineering, Copper interconnect, Extrusion, Dielectric, Composite material, Electromigration, Failure mode and effects analysis, Thermal expansion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::77a800aca5d8a5e8fbfb5dead3bb6d71
https://doi.org/10.1109/ipfa.2001.941480