المؤلفون: Guan, Q., Yap, Y.F., Goharzadeh, A., Chai, J.C., Vargas, F.M., Chapman, W.G., Zhang, M.

المصدر: 2017 7th International Conference on Modeling, Simulation, and Applied Optimization (ICMSAO) Modeling, Simulation, and Applied Optimization (ICMSAO), 2017 7th International Conference on. :1-6 Apr, 2017

Relation: 2017 7th International Conference on Modeling, Simulation, and Applied Optimization (ICMSAO)

المؤلفون: Li, X., Yap, Y.F., Goharzadeh, A., Chai, J.C., Zhang, M.

المصدر: 2017 7th International Conference on Modeling, Simulation, and Applied Optimization (ICMSAO) Modeling, Simulation, and Applied Optimization (ICMSAO), 2017 7th International Conference on. :1-5 Apr, 2017

Relation: 2017 7th International Conference on Modeling, Simulation, and Applied Optimization (ICMSAO)

المؤلفون: Jia, G.S., Ma, Z.D., Xia, Z.H., Zhang, Y.P., Xue, Y.Z., Chai, J.C., Jin, L.W.

المصدر: In Renewable Energy January 2022 182:296-313

المؤلفون: Chai, J.C., Britting, A.O., Jr., Feng, S.

المصدر: 2006 17th International Zurich Symposium on Electromagnetic Compatibility Electromagnetic Compatibility Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on. :132-135 2006

Relation: 17th International Zurich Symposium on Electromagnetic Compatibility

المؤلفون: Yap, Y.F., Toh, K.C., Wong, T.N., Chai, J.C.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :575-580 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Chai, J.C., Feng, S.Y., Dressel, E., Montegut, J.L.

المصدر: 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Electromagnetic compatibility Electromagnetic Compatibility, 2003 IEEE International Symposium on. 2:489-494 vol.2 2003

Relation: International Symposium on Electromagnetic Compatibility

المؤلفون: Chai, J.C., Dressel, E., Britting, A.O., Montegut, J.L.

المصدر: 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Electromagnetic compatibility Electromagnetic Compatibility, 2003 IEEE International Symposium on. 1:286-291 vol.1 2003

Relation: International Symposium on Electromagnetic Compatibility

المؤلفون: Chen, X.Y., Toh, K.C., Chai, J.C., Wong, T.N., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :633-637 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Chen, X.Y., Toh, K.C., Chai, J.C., Pinjala, D.

المصدر: 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :380-384 2002

Relation: Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002)

المؤلفون: Chai, J.C., Britting, A.O., Jr.

المصدر: IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016) Electromagnetic compatibility - Washington Electromagnetic Compatibility, 2000. IEEE International Symposium on. 2:955-960 vol.2 2000

Relation: Proceedings of 2000 International Symposium on Electromagnetic Compatibility (EMC 2000)