يعرض 1 - 10 نتائج من 89 نتيجة بحث عن '"Chai, T. C."', وقت الاستعلام: 0.98s تنقيح النتائج
  1. 1
    مؤتمر
    Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

    المؤلفون: Bhattacharya, S., Lim, T. G., Ho, D., Chui, K. J., Zhang, X. W., Rotaru, M. D., Sajay, B. G., Chai, T. C., Chong, S. C., Li, H. Y., Lim, S., Wang, X. Y., Jong, M. C., Sekhar, V. N., Dutta, R., Rao, Vempati S.

    المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :3.1.1-3.1.4 Dec, 2022

    Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

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  2. 2
    مؤتمر
    Thermal design and analysis of through silicon interposer (TSI) package

    المؤلفون: Bu, Lin, Han, Yong, Zhang, Xiaowu, Chai, T. C.

    المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-5 Dec, 2017

    Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

    المؤلفون: Zhang, L., Chai, T. C., Wai, L. C., Lam, T. W., Vallett, D. P., Tang, J.

    المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-5 Dec, 2015

    Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Modeling and characterization of Cu wire bonding process on silicon chip with 45nm node and Cu/low-k structures

    المؤلفون: Che, F. X., Wai, Leong Ching, Zhang, Xiaowu, Chai, T. C.

    المصدر: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :270-275 Dec, 2013

    Relation: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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  5. 5
    مؤتمر
    Design and development of micro-sensors for measuring localised stresses during copper wirebonding

    المؤلفون: Zhang, Xiaowu, Selvanayagam, Cheryl S., Yong, Woon Yik, Chai, T. C., Trigg, A. D.

    المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :244-250 Dec, 2012

    Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

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  6. 6
    مؤتمر
    Development of numerical modeling approach on substrate warpage prediction

    المؤلفون: Biswas, Kalyan, Liu, Shiguo, Zhang, Xiaowu, Chai, T. C.

    المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :462-466 Dec, 2012

    Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

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  7. 7
    مؤتمر
    Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package

    المؤلفون: Che, F. X., Chai, T. C., Lim, Sharon P. S., Rajoo, Ranjan, Zhang, Xiaowu

    المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1428-1435 May, 2011

    Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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  8. 8
    دورية أكاديمية
    3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging

    المؤلفون: Ji, L., Sorono, D. V., Chai, T. C., Zhang, X.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(4):678-687 Apr, 2013

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  9. 9
    دورية أكاديمية
    In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors

    المؤلفون: Yong, W. Y., Zhang, X., Chai, T. C., Trigg, A., Jaafar, N. B., Lo, G.-Q.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(2):328-335 Feb, 2013

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  10. 10
    دورية أكاديمية
    Structure Design Optimization and Reliability Analysis on a Pyramidal-Shape Three-Die-Stacked Package With Through-Silicon Via

    المؤلفون: Che, F. X., Lim, S. P. S., Chai, T. C., Zhang, X.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 12(2):201-208 Jun, 2012

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