المؤلفون: M, Shanmuga Sundari, Srividya, K., Jadala, Vijaya Chandra, Chandrasekhar, U., Durga, Kbks, Ammangatambu, Mayukha Mandya

المصدر: 2023 3rd International Conference on Innovative Mechanisms for Industry Applications (ICIMIA) Innovative Mechanisms for Industry Applications (ICIMIA), 2023 3rd International Conference on. :396-400 Dec, 2023

Relation: 2023 3rd International Conference on Innovative Mechanisms for Industry Applications (ICIMIA)

المؤلفون: Wang, Z., Wei, Z., Wu, G., Hu, L., Wu, M., Chandrasekhar, U., Tran, T., Baraji, M., Li, J., Abedifard, E., Huai, Y.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Chandrasekhar, U., Padmavati, E. G

المصدر: 2022 International Conference on Smart Generation Computing, Communication and Networking (SMART GENCON) Smart Generation Computing, Communication and Networking (SMART GENCON), 2022 International Conference on. :1-5 Dec, 2022

Relation: 2022 International Conference on Smart Generation Computing, Communication and Networking (SMART GENCON)

المؤلفون: Reddy, B. Veera Siva^{Aff1, IDs12666023031462_cor1}, Shaik, Ameer Malik^{Aff1, Aff3}, Sundeep, Dola, Chebiyyam, Chandrasekhara Sastry^{Aff1, IDs12666023031462_cor4}, Krishnaiah, J., Chandrasekhar, U.

المصدر: Transactions of the Indian Institute of Metals. 77(3):615-626

المؤلفون: Jagatheeshkumar, S., Raguraman, M.^{Aff1, IDs1200802301560w_cor2}, Siva Prasad, A. V. S., Nagesha, B. K., Chandrasekhar, U.

المصدر: International Journal on Interactive Design and Manufacturing (IJIDeM). :1-14

المؤلفون: Kulkarni, Sudheer D.^{Aff1, Aff2, IDs12008023014056_cor1}, Manjunatha, Chandrasekhar, U., Manjunath, K. V., Prasad, C. Durga^{Aff6, IDs12008023014056_cor5}, Vasudev, Hitesh

المصدر: International Journal on Interactive Design and Manufacturing (IJIDeM). :1-16

المؤلفون: Jagatheeshkumar S, Raguraman M, Siva Prasad AVS, Nagesha B K, Chandrasekhar U

المصدر: Defence Technology, Vol 28, Iss , Pp 33-41 (2023)

مصطلحات موضوعية: Ti6Al4V, Thin-walled geometry, Residual stress, Inherent strain, XRD, Ansys additive print, Military Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214914723000028; https://doaj.org/toc/2214-9147

URL الوصول: https://doaj.org/article/1df3699536bd43278e499b9122231331

المؤلفون: Tushara, Nivarthi^Aff5, Sahithi, Voraganti^Aff5, Haripriya, Bushgari^Aff5, Chandrasekhar, U.^Aff5

المساهمون: Xhafa, Fatos, Series Editor^Aff1, Rajakumar, G., editor^Aff2, Du, Ke-Lin, editor^Aff3, Rocha, Álvaro, editor^Aff4

المصدر: Intelligent Communication Technologies and Virtual Mobile Networks : Proceedings of ICICV 2023. 171:925-937

المؤلفون: Karthik, P, Saurabh, M, Chandrasekhar, U

المصدر: 2016 International Conference on Advances in Computing, Communications and Informatics (ICACCI) Advances in Computing, Communications and Informatics (ICACCI), 2016 International Conference on. :1219-1223 Sep, 2016

Relation: 2016 International Conference on Advances in Computing, Communications and Informatics (ICACCI)

المؤلفون: Marudhappan, Raja^{Aff1, IDs40032022008120_cor1}, Chandrasekhar, U.

المصدر: Journal of The Institution of Engineers (India): Series C: Mechanical, Production, Aerospace and Marine Engineering. 103(4):1013-1030