المؤلفون: Chang-Chi Lee, Hou-Ming Chen, Chi-Chang Lu, Bo-Yi Lee, Hsien-Chi Huang, He-Sheng Fu, Yong-Xin Lin

المصدر: IEEE Access, Vol 8, Pp 62632-62638 (2020)

مصطلحات موضوعية: Bandgap reference, line regulation, temperature coefficient (TC), temperature drift, v-curve correction (VCC) circuit, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9052729/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/4fd1c922616f4c98a67fbfd71a0dec8d

المؤلفون: Cadmus C. A. Yuan, Chang-Chi Lee

المصدر: IEEE Access, Vol 8, Pp 143494-143501 (2020)

مصطلحات موضوعية: Wafer level package, chip-scale package, reliability, machine learning, recurrent neural networks, long short-term memory, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9157872/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/0a0934b6768c42c184157f8d8aff6810

المؤلفون: Jeng-Yue Chen, Gwo-Jen Chiou, Tsung-Cheng Chen, Chi-Kai Lin, Chang-Chi Lee

المصدر: 2015 IEEE 2nd International Future Energy Electronics Conference (IFEEC) Future Energy Electronics Conference (IFEEC), 2015 IEEE 2nd International. :1-5 Nov, 2015

Relation: 2015 IEEE 2nd International Future Energy Electronics Conference (IFEEC)

المؤلفون: Yi-Shao Lai, Tong Hong Wang, Chang-Chi Lee, Hsuan-Yu Chen

المصدر: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. :1-6 2006

Relation: EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Yi-Shao Lai, Tong Hong Wang, Chang-Chi Lee

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :539-544 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :36-40 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Tong Hong Wang, Chang Chi Lee, Yi-Shao Lai, Chun-En Huang

المصدر: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. :26-30 2004

Relation: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

المؤلفون: Tong Hong Wang, Hsuan-Yu Chen, Chang-Chi Lee, Yi-Shao Lai

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :465-468 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Tong Hong Wang, Paisner, Sara N., Chang-Chi Lee, Susan Chen, Yi-Shao Lai

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :581-584 Oct, 2009

Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Ching-Chun Wang

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :202-206 Oct, 2007

Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology