المؤلفون: Kao, Frank, Zhi Hao Tseng, Chun Sheng Ho, Stan Chen, Chang-Yi Lan, Feng Lung Chien

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :323-326 Oct, 2007

Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology

المؤلفون: Chang-Yi Lan, Zhi Hao Tseng, Feng Lung Chien, Scott Chen, Chun Sheng Ho, F. Kao

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology.

مصطلحات موضوعية: Surface-mount technology, Engineering, business.industry, Structural engineering, Temperature cycling, Drop test, Printed circuit board, Reliability (semiconductor), Chip-scale package, visual_art, Soldering, Electronic component, visual_art.visual_art_medium, Electronic engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::87bd0e0ea8d91c87929745cd33b5b4c0
https://doi.org/10.1109/impact.2007.4433627