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المؤلفون: Chih-Pin Hung, Chi-Han Chen, Pao-Nan Lee, Meng-Jen Wang, Kuan-Chung Lu, Chang-Ying Hung, Tzyy-Sheng Horng, Ho-Ming Tong
المصدر: International Symposium on Microelectronics. 2012:001215-001220
مصطلحات موضوعية: Interconnection, Materials science, Through-silicon via, business.industry, Three-dimensional integrated circuit, Chip, Ball grid array, Automotive Engineering, Interposer, Electronic engineering, Optoelectronics, Integrated circuit packaging, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a27f63dec7829fe09031e4e8865d0721
https://doi.org/10.4071/isom-2012-thp62 -
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المؤلفون: Chang Ying Hung, George Spanos, Milo V. Kral
المصدر: Materials Science Forum. :1599-1604
مصطلحات موضوعية: Materials science, Morphology (linguistics), Ledeburite, Cementite, Mechanical Engineering, Metallurgy, engineering.material, Condensed Matter Physics, High carbon, chemistry.chemical_compound, chemistry, Mechanics of Materials, engineering, General Materials Science, Grain boundary, Mechanism (sociology)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::013493c6094c03f39edf195429e01dc3
https://doi.org/10.4028/www.scientific.net/msf.426-432.1599 -
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المؤلفون: Chang-Ying Hung, Kuan-Chung Lu, Chih-Pin Hung, Chi-Han Chen, Meng-Jen Wang, Pao-Nan Lee, Ho-Ming Tong, Tzyy-Sheng Horng
المصدر: 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
مصطلحات موضوعية: Interconnection, Materials science, Silicon, chemistry, Through-silicon via, Parasitic capacitance, Scalability, Electronic engineering, Insertion loss, chemistry.chemical_element, Wideband, Capacitance
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1328e33454fef588e71d7ad5e3bc16bc
https://doi.org/10.1109/edaps.2012.6469406 -
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المؤلفون: Chi-Han Chen, Meng-Jen Wang, Chin-Li Kao, Pao-Nan Lee, Ho-Ming Tong, Chih-Pin Hung, Chang-Ying Hung
المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference.
مصطلحات موضوعية: Materials science, Through-silicon via, business.industry, Chip-scale package, Ball grid array, Electronic engineering, Interposer, Optoelectronics, Three-dimensional integrated circuit, Integrated circuit packaging, business, Flip chip, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bf163451251e009a946965f6007def48
https://doi.org/10.1109/ectc.2012.6248842