المؤلفون: JoonYeob Lee, KwangSeok Oh, ChanHa Hwang, ChoonHeung Lee, St. Amand, Roger D.

المصدر: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :954-959 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

المؤلفون: Jooyong Shim, Daiwon Kim, Jung-Suk Yu, Sang Bum Lee, Chanha Hwang

المصدر: Model Assisted Statistics and Applications. 15:239-248

مصطلحات موضوعية: Statistics and Probability, business.industry, Computer science, Applied Mathematics, 05 social sciences, Spatial error, Pattern recognition, 01 natural sciences, 010104 statistics & probability, Modeling and Simulation, Kernel (statistics), 0502 economics and business, Artificial intelligence, 050207 economics, 0101 mathematics, business, Panel data

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d423f9092ad6d564c641c0fcf3d76a0
https://doi.org/10.3233/mas-200491

المؤلفون: MinJae Lee, Sungsoon Park, Myung-June (M J) Lee, Youshin Jung, Choonheung Lee, DongSu Ryu, Yanggyoo Jung, ChanHa Hwang, Sunwoo Park, Miguel Jimarez

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference.

مصطلحات موضوعية: Thermal copper pillar bump, Interconnection, Materials science, business.industry, Thermocompression bonding, engineering.material, Coating, Chip-scale package, Ball grid array, Soldering, Hardware_INTEGRATEDCIRCUITS, engineering, Electronic engineering, Optoelectronics, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::708308f1ba5960d3ca68b7fdd6a8adbb
https://doi.org/10.1109/ectc.2012.6248868

المؤلفون: SeungJae Lee, BooYang Jung, Kicheol Bae, Choonheung Lee, Jiheon Yu, YoungSuk Chung, SangWon Kim, Brett Arnold Dunlap, Nozad Karim, Jin Young Kim, ChanHa Hwang

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Coplanar waveguide, Laser beam machining, Extremely high frequency, Electrical engineering, Optoelectronics, Wafer, business, Wafer-level packaging, Die (integrated circuit), Laser drilling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::90bfe023c7c07ef8920e8f75b61c5bf4
https://doi.org/10.1109/ectc.2010.5490804

المؤلفون: Choonheung Lee, ChanHa Hwang, Jiheon Yu, SeungJae Lee, Kicheol Bae, YoungSuk Chung

المصدر: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).

مصطلحات موضوعية: Printed circuit board, Engineering, business.industry, Frequency domain, Electrical engineering, Process (computing), Electronic engineering, Electronic packaging, Solid modeling, Quad Flat No-leads package, business, Lead (electronics), Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::49dd44de0bd94e8d7732cbc71786ec2e
https://doi.org/10.1109/edaps.2009.5404000

المؤلفون: Do Hyung Kim, KyeongSool Seong, ChoonHeong Lee, BongChan Kim, Yoon-joo Kim, JaeKyu Song, ChanHa Hwang

المصدر: 2009 59th Electronic Components and Technology Conference.

مصطلحات موضوعية: Die preparation, Materials science, business.industry, Electronic engineering, Optoelectronics, Wafer testing, Wafer dicing, Wafer, business, Wafer backgrinding, Wafer-level packaging, Die (integrated circuit), Embedded Wafer Level Ball Grid Array

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e5be8acfcc3beafb9301eba75cd731ef
https://doi.org/10.1109/ectc.2009.5074216

المؤلفون: SeungJae Lee, KiCheol Bae, Jiheon Yu, YoungSuk Chung, ChanHa Hwang, ChoonHeung Lee

المصدر: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS); 2009, p1-4, 4p

المؤلفون: DoHyung Kim, YoonJoo Kim, KyeongSool Seong, JaeKyu Song, BongChan Kim, ChanHa Hwang, ChoonHeong Lee

المصدر: 2009 59th Electronic Components & Technology Conference; 2009, p1531-1536, 6p